List of contributors

Autor: Timo Aalto, Veli-Matti Airaksinen, Stephan Gerhard Albert, Giorgio Allegato, Marco Amiotti, Olli Anttila, Juergen Auersperg, Antonio Bonucci, Indranil Ronnie Bose, Tanja Braun, Mikael Broas, J. Burggraf, Christopher Cameron, Rob N. Candler, Zhen Cao, André Cardoso, Kuo-Shen Chen, Andrea Conte, Adriana Cozma, Cristina E. Davis, Sophia Dempwolf, Pradeep Dixit, Michael Dost, Viorel Dragoi, Simo Eränen, Bruno Fain, B. Figeys, Andreas C. Fischer, Christoph Flötgen, Sami Franssila, Alois Friedberger, Marc Fueldner, Maria Ganchenkova, Pilar Gonzalez, Miguel A. Gosálvez, Michael Grimes, Atte Haapalinna, Paul Hagelin, Paul Hammond, Kimmo Henttinen, Vesa Henttonen, David Horsley, Takeo Hoshi, Satoshi Itoh, Henrik Jakobsen, R. Jansen, Kerstin Jonsson, Dirk Kähler, Harindra Kumar Kannojia, Hannu Kattelus, Gudrun Kissinger, Roy Knechtel, Kathrin Knese, Kai Kolari, Mika Koskenvuori, Heikki Kuisma, Amit Kulkarni, Franz Laermer, Christof Landesberger, Christina Leinenbach, Michael K. LeVasseur, Jue Li, Yuyuan Lin, Paul F. Lindner, K. Lodewijks, Fabian Lofink, Giorgio Longoni, Sebastian Markus Luber, M. Mahmud-ul-hasan, Jari Mäkinen, Matti Mäntysalo, Devin Martin, Federico Maspero, Toni T. Mattila, Luca Mauri, Peter Merz, Doug Meyer, Marco Moraja, Teruaki Motooka, Gerhard Müller, Paul Muralt, Risto M. Nieminen, Frank Niklaus, Laura Oggioni, Juuso Olkkonen, Elmeri Österlund, Kuang-Shun Ou, Jari Paloheimo, Toni P. Pasanen, Mervi Paulasto-Kröckel, Thomas Plach, Jean-Philippe Polizzi, Klaus Pressel, Matti Putkonen, Riikka L. Puurunen, Wolfgang Reinert, Enea Rizzi, V. Rochus, Glenn Ross, X. Rottenberg, Lauri Sainiemi, Hele Savin, Harald Schenk, Marc Schikowski, Matthias Schulze, S. Seema, S. Severi, Lasse Skogström, Tadatomo Suga, Scott Sullivan, Tommi Suni, Horst Theuss, Markku Tilli, H.A.C. Tilmans, Ilkka Tittonen, Hannah Tofteberg, Pekka Törmä, Santeri Tuomikoski, Frode Tyholdt, Tsuyoshi Uda, Örjan Vallin, Carlo Valzasina, Timo Veijola, Eeva Viinikka, Dietmar Vogel, Andreas Vogl, Vesa Vuorinen, W.J. Westervelde, Sebastian Wicht, Robert Wieland, Bernhard Winkler, Levent Yobas, Luca Zanotti, I. Zubel

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::16f0bddf47c3d8c3eaa0f0359a359b22
https://doi.org/10.1016/b978-0-12-817786-0.00065-7

An approach to adjust the board-level drop test conditions to improve the correlation with product-level drop impact

Autor: Manu Mäkelä, Toni T. Mattila, Heikki Ruotoistenmäki, Jussi Hokka, Ville Halkola, Markku Sillanpää, Esa Hussa, Jani Raami

Publikováno v: Microelectronics Reliability. 54:785-795

A consortium composed of industrial and academic representatives has been working on an update for the widely-employed JESD22-B111 drop test standard for handheld electronics. To form a better understanding of the drop response of handheld devices, t

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::50420762dac159c150a5b2d698711a54
https://doi.org/10.1016/j.microrel.2013.11.017

Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading

Autor: Mikael Broas, Jani Raami, Toni T. Mattila, Jue Li, Mervi Paulasto-Kröckel

Publikováno v: Microelectronics Reliability. 54(6-7):1228-1234

In this work the reliability of a Micro-Electro-Mechanical Systems (MEMS) microphone is studied through two accelerated life tests, mixed flowing gas (MFG) testing and shock impact testing. The objective is to identify the associated failure mechanis

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cf69da09afe928a14fd7bb038467557b
http://juuli.fi/Record/0338134314

Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections—Part 2: Failure Mechanisms

Autor: Hongbo Xu, Mervi Paulasto-Kröckel, Jussi Hokka, Toni T. Mattila

Publikováno v: Journal of Electronic Materials. 42:963-972

Part 1 of this study focused on identifying the effects of (i) temperature difference (ΔT), (ii) lower dwell temperature and shorter dwell time, (iii) mean temperature, (iv) dwell time, and (v) ramp rate on the lifetime of ball grid array (with 144

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::898f2eda5afafcfa0d4218cfdf839d55
https://doi.org/10.1007/s11664-013-2475-5

The reliability of component boards studied with different shock impact repetition frequencies

Autor: Mervi Paulasto-Kröckel, Jue Li, Toni T. Mattila, Jussi Hokka

Publikováno v: Microelectronics Reliability. 52:1445-1453

As a result of the ever-shortening time to market of new electronic products there is a clear need to make the currently employed reliability assessment procedures more efficient. However, while trying to achieve these cost savings it is important to

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6314f738ce789978ab1f9b4a430c5d4c
https://doi.org/10.1016/j.microrel.2012.02.024