Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Tongzhi Yang"'
Publikováno v:
Applied Sciences, Vol 13, Iss 13, p 7472 (2023)
As a powerful solution for heat dissipation in data centers, chip-level cooling continues to capture escalating attention in research and application domains. To accurately analyze system performance, identify potential avenues for system optimizatio
Externí odkaz:
https://doaj.org/article/94714a0bd2e24505ae79c853ea343975
Publikováno v:
Applied Sciences; Volume 13; Issue 13; Pages: 7472
As a powerful solution for heat dissipation in data centers, chip-level cooling continues to capture escalating attention in research and application domains. To accurately analyze system performance, identify potential avenues for system optimizatio
Publikováno v:
2022 International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence (ICSMD).
Publikováno v:
2022 International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence (ICSMD).
Publikováno v:
2021 IEEE 15th International Conference on Electronic Measurement & Instruments (ICEMI).
Publikováno v:
2021 IEEE 15th International Conference on Electronic Measurement & Instruments (ICEMI).
Publikováno v:
Journal of Heat Transfer. 142
This study investigates the thermal performance of a parallel strip fin heat sink (PSFHS) under various heat flux conditions at a flowrate of 100 ml/min, including uniform heat flux and nonuniform heat flux. The heat sink consists of 150 fins with a
Publikováno v:
Applied Thermal Engineering. 182:116102
The present study experimentally explored the flow boiling phenomena in mini-scale heat sinks under local heating conditions. A parallel strip fin heat sink (PSFHS) and a mini-channel heat sink (MCHS) are comparatively tested using R141b as working f
Publikováno v:
IOP Conference Series: Earth and Environmental Science. 529:012008
The mini/micro-channel heat sinks have already been a successful innovation for cooling of electronic devices, and many factors could affect their thermal performance. However, the flow distribution is one of the fatal factors influencing the perform
Publikováno v:
Journal of Heat Transfer; Dec2020, Vol. 142 Issue 12, p1-11, 11p