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Autor:
Prabhakar Subrahmanyam, Muhammad Ahmad, Ying-Feng Pang, Rahima K. Mohammed, Ridvan A. Sahan, Amy Xia, Tong W. Chao
Publikováno v:
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
With the ever increasing trend of cramming more transistors on the silicon and the consequential increase in the thermal design power, combined with stacked die and multiple die configurations inside the package footprint, optimized coolant chambers
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::722cdf3dd45b179e7f77cc70a6d2794d
https://doi.org/10.1109/itherm.2017.7992538
https://doi.org/10.1109/itherm.2017.7992538
