Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Tong KN"'
Autor:
Yan J; Department of Materials Science and Engineering, Department of Chemistry, and Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, Hong Kong, 999077, HONG KONG., Wu C; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China., Tong KN; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China., Zhou F; Department of Materials Science and Engineering, Department of Chemistry, and Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, Hong Kong, 999077, HONG KONG., Chen Y; Department of Materials Science and Engineering, Department of Chemistry, and Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, Hong Kong, 999077, HONG KONG., Pan Y; Department of Materials Science and Engineering, Department of Chemistry, and Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, Hong Kong, 999077, HONG KONG., Xie G; The Institute of Flexible Electronics (Future Technologies), Xiamen University, Xiamen, 361005, China., Chi Y; Department of Materials Science and Engineering, Department of Chemistry, and Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, Hong Kong, 999077, HONG KONG., Lau KC; Department of Materials Science and Engineering, Department of Chemistry, and Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, Hong Kong, 999077, HONG KONG., Wei G; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China.
Publikováno v:
Small methods [Small Methods] 2024 Nov; Vol. 8 (11), pp. e2301555. Date of Electronic Publication: 2024 Jan 07.
Autor:
Shi K; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China.; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Wu C; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China.; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Zhang H; Hubei Key Lab on Organic and Polymeric Optoelectronic Materials, Department of Chemistry, Wuhan University, Wuhan, 430072, China., Tong KN; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., He W; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Li W; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China., Jin Z; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Jung S; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China.; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Li S; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Wang X; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Gong S; Hubei Key Lab on Organic and Polymeric Optoelectronic Materials, Department of Chemistry, Wuhan University, Wuhan, 430072, China., Zhang Y; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, China., Zhang D; Key Laboratory of Organic Optoelectronics and Molecular Engineering of Ministry of Education, Department of Chemistry, Tsinghua University, Beijing, China., Kang F; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Chi Y; Department of Materials Science and Engineering, Department of Chemistry and Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, Hong Kong SAR, 999077, China., Yang C; Shenzhen Key Laboratory of New Information Display and Storage Materials, College of Materials Science and Engineering, Shenzhen University, Shenzhen, 518060, China., Wei G; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China.; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China.
Publikováno v:
Advanced science (Weinheim, Baden-Wurttemberg, Germany) [Adv Sci (Weinh)] 2024 Oct; Vol. 11 (38), pp. e2402349. Date of Electronic Publication: 2024 Aug 13.
Autor:
Kuang C; School of Advanced Materials, Peking University Shenzhen Graduate School, Peking University, Shenzhen, 518055, China., Li S; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Murtaza I; Department of Physics, International Islamic University, Islamabad, 44000, Pakistan., Meng Z; School of Advanced Materials, Peking University Shenzhen Graduate School, Peking University, Shenzhen, 518055, China., Li H; School of Advanced Materials, Peking University Shenzhen Graduate School, Peking University, Shenzhen, 518055, China., Zhang X; School of Advanced Materials, Peking University Shenzhen Graduate School, Peking University, Shenzhen, 518055, China., Wu C; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Tong KN; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Shang Y; School of Advanced Materials, Peking University Shenzhen Graduate School, Peking University, Shenzhen, 518055, China., He Y; School of Advanced Materials, Peking University Shenzhen Graduate School, Peking University, Shenzhen, 518055, China., Zhu Y; Faculty of Materials Science, Shenzhen MSU-BIT University, Shenzhen, 518172, China., Wei G; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Meng H; School of Advanced Materials, Peking University Shenzhen Graduate School, Peking University, Shenzhen, 518055, China.
Publikováno v:
Small (Weinheim an der Bergstrasse, Germany) [Small] 2024 Jun; Vol. 20 (24), pp. e2311114. Date of Electronic Publication: 2023 Dec 29.
Autor:
Sun SQ; Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Institute of Functional Nano & Soft Materials (FUNSOM), Soochow University, Suzhou, Jiangsu, 215123, P. R. China., Tai JW; Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Institute of Functional Nano & Soft Materials (FUNSOM), Soochow University, Suzhou, Jiangsu, 215123, P. R. China., He W; Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Institute of Functional Nano & Soft Materials (FUNSOM), Soochow University, Suzhou, Jiangsu, 215123, P. R. China., Yu YJ; Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Institute of Functional Nano & Soft Materials (FUNSOM), Soochow University, Suzhou, Jiangsu, 215123, P. R. China., Feng ZQ; Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Institute of Functional Nano & Soft Materials (FUNSOM), Soochow University, Suzhou, Jiangsu, 215123, P. R. China., Sun Q; Macau Institute of Materials Science and Engineering (MIMSE), MUST-SUDA Joint Research Center for Advanced Functional Materials, Zhuhai MUST Science and Technology Research Institute, Macau University of Science and Technology, Taipa, Macau, 999078, P. R. China., Tong KN; Institute of Materials Science, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, Guangdong, 518055, P. R. China., Shi K; Institute of Materials Science, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, Guangdong, 518055, P. R. China., Liu BC; Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Institute of Functional Nano & Soft Materials (FUNSOM), Soochow University, Suzhou, Jiangsu, 215123, P. R. China., Zhu M; Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Institute of Functional Nano & Soft Materials (FUNSOM), Soochow University, Suzhou, Jiangsu, 215123, P. R. China., Wei G; Institute of Materials Science, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, Guangdong, 518055, P. R. China., Fan J; Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Institute of Functional Nano & Soft Materials (FUNSOM), Soochow University, Suzhou, Jiangsu, 215123, P. R. China., Xie YM; Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Institute of Functional Nano & Soft Materials (FUNSOM), Soochow University, Suzhou, Jiangsu, 215123, P. R. China.; Jiangsu Key Laboratory of Advanced Negative Carbon Technologies, Soochow University, Suzhou, Jiangsu, 215123, P.R. China., Liao LS; Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Institute of Functional Nano & Soft Materials (FUNSOM), Soochow University, Suzhou, Jiangsu, 215123, P. R. China.; Macau Institute of Materials Science and Engineering (MIMSE), MUST-SUDA Joint Research Center for Advanced Functional Materials, Zhuhai MUST Science and Technology Research Institute, Macau University of Science and Technology, Taipa, Macau, 999078, P. R. China., Fung MK; Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Institute of Functional Nano & Soft Materials (FUNSOM), Soochow University, Suzhou, Jiangsu, 215123, P. R. China.; Macau Institute of Materials Science and Engineering (MIMSE), MUST-SUDA Joint Research Center for Advanced Functional Materials, Zhuhai MUST Science and Technology Research Institute, Macau University of Science and Technology, Taipa, Macau, 999078, P. R. China.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Jun; Vol. 36 (24), pp. e2400421. Date of Electronic Publication: 2024 Mar 10.
Autor:
Tong KN; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Wu C; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China.; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China., Wu Y; PURI Materials, Shenzhen, 518133, China., Li S; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Jin Z; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Shi K; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China.; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China., Jung S; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China.; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China., Wang X; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Guan Y; PURI Materials, Shenzhen, 518133, China., Yang C; PURI Materials, Shenzhen, 518133, China., Wei G; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China.; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China.
Publikováno v:
Small (Weinheim an der Bergstrasse, Germany) [Small] 2024 Mar; Vol. 20 (12), pp. e2307500. Date of Electronic Publication: 2023 Nov 08.
Autor:
Wu C; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China.; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Tong KN; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Shi K; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China.; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Jin Z; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Wu Y; PURI Materials, Inc, Shenzhen, 518133, China., Mu Y; School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou, 510006, China., Huo Y; School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou, 510006, China., Tang MC; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Yang C; PURI Materials, Inc, Shenzhen, 518133, China., Meng H; School of Advanced Materials, Shenzhen Graduate School, Peking University, Shenzhen, 518055, China., Kang F; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China.; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China., Wei G; Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen, 518055, China.; Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China.
Publikováno v:
Advanced science (Weinheim, Baden-Wurttemberg, Germany) [Adv Sci (Weinh)] 2023 Oct; Vol. 10 (29), pp. e2301112. Date of Electronic Publication: 2023 Aug 31.
Autor:
Wang YY; Institute of Functional Nano & Soft Materials (FUNSOM), Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Soochow University, Suzhou, Jiangsu 215123, China. mkfung@suda.edu.cn jianfan@suda.edu.cn., Tong KN, Zhang K, Lu CH, Chen X, Liang JX, Wang CK, Wu CC, Fung MK, Fan J
Publikováno v:
Materials horizons [Mater Horiz] 2021 Apr 01; Vol. 8 (4), pp. 1297-1303. Date of Electronic Publication: 2021 Feb 17.
Autor:
Tong KN; Department of Oral & Maxillofacial Pathology, Naval Postgraduate Dental School, Naval Medical Professional Development Center, 8955 Wood Road, Bethesda, MD, 20889-5638, USA., Seltzer S; Department of Radiology, Fort Belvoir Community Hospital, 9300 DeWitt Loop, Fort Belvoir, VA, 22060, USA., Castle JT; Department of Oral & Maxillofacial Pathology, Naval Postgraduate Dental School, Naval Medical Professional Development Center, 8955 Wood Road, Bethesda, MD, 20889-5638, USA. James.T.Castle4.mil@mail.mil.
Publikováno v:
Head and neck pathology [Head Neck Pathol] 2020 Mar; Vol. 14 (1), pp. 220-223. Date of Electronic Publication: 2019 Mar 19.
Autor:
Tong KN; Naval Postgraduate Dental School, Department of Oral and Maxillofacial Pathology, Walter Reed National Military Medical Center, 8955 Wood Road, Bethesda, MD, 20889-5628, USA. kimberly.n.tong.mil@mail.mil., Serra RM; Department of Otolaryngology, Womack Army Medical Center, Fort Bragg, NC, USA., Shih RY; Department of Radiology, Walter Reed National Military Medical Center, Bethesda, MD, USA., Foss RD; Head & Neck Pathology, Joint Pathology Center, Silver Spring, MD, USA.
Publikováno v:
Head and neck pathology [Head Neck Pathol] 2019 Jun; Vol. 13 (2), pp. 239-242. Date of Electronic Publication: 2018 Mar 28.