Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Tomonori Ogawa"'
Autor:
Rao Tummala, Tomonori Ogawa, Pulugurtha Markondeya Raj, Atom Watanabe, Bijan Tehrani, Manos M. Tentzeris
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:531-533
This letter, for the first time, presents low-loss substrate-integrated waveguides (SIWs) in fused silica and borosilicate glass and a comparison of their performance with various organic-based low-loss substrates for millimeter-wave applications. Ut
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59267da31b46a778637924efeaf4ea20
https://doi.org/10.1109/tcpmt.2020.2968305
https://doi.org/10.1109/tcpmt.2020.2968305
Autor:
Siddharth Ravichandran, Shuhei Yamada, Tomonori Ogawa, Tailong Shi, Fuhan Liu, Vanessa Smet, Venky Sundaram, Rao Tummala
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 16:124-135
This article demonstrates a next-generation high-performance 3D packaging technology with smaller form factor, excellent electrical performance, and reliability for heterogeneous integration. High-density logic-memory integration, today, is built pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::245c43bf78c52b1c5c7a848d3f089551
https://doi.org/10.4071/imaps.930748
https://doi.org/10.4071/imaps.930748
Autor:
Venky Sundaram, Shuhei Yamada, Vanessa Smet, Tomonori Ogawa, Tailong Shi, Rao Tummala, Fuhan Liu, Siddharth Ravichandran
Publikováno v:
International Symposium on Microelectronics. 2018:000331-000336
This paper demonstrates a next generation high-performance 3D packaging architecture with smaller form factor, excellent electrical performance and reliability for heterogeneous integration. High density Logic-HBM integration, today, is built predomi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c5c437752996b447e531c90ea1a64fe
https://doi.org/10.4071/2380-4505-2018.1.000331
https://doi.org/10.4071/2380-4505-2018.1.000331
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 17:683-691
Reliability of through-package vias (TPVs) in 100- ${\mu }\text{m}$ glass, prefabricated with an innovative via-first process, is investigated through systematic modeling, design, fabrication, and reliability characterization. Finite element models w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::791c42b6fb39176870f1211f33c4c466
https://doi.org/10.1109/tdmr.2017.2752730
https://doi.org/10.1109/tdmr.2017.2752730
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:544-551
A via-first process for metallizing copper on glass substrates is presented using a thin, patternable polymer film, electroless copper deposition, and semiadditive processing. A procedure for partially precuring the polymer was developed in order to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e682c7b9274a8b7bfb6c18be0d2180f4
https://doi.org/10.1109/tcpmt.2017.2654219
https://doi.org/10.1109/tcpmt.2017.2654219
Autor:
Tomonori Ogawa, P. Markondeya Raj, Muhammad Ali, Manos M. Tentzeris, Rao Tummala, Madhavan Swaminathan, Atom Watanabe, Tong-Hong Lin
Publikováno v:
2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G).
This paper reports the first demonstration of antenna-in-package and seamless antenna-to-receiver signal transitions on panel-scale processed ultra-thin glass substrates, for high-speed 5G communication standards in the 28 GHz band. To demonstrate th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68496a7d4cd173a433dce6c2a1c7f538
https://doi.org/10.1109/imc-5g47857.2019.9160350
https://doi.org/10.1109/imc-5g47857.2019.9160350
Autor:
Tomonori Ogawa, Atom Watanabe, Rao Tummala, Manos M. Tentzeris, Tong-Hong Lin, P. Markondeya Raj, Venky Sundaram
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
This paper demonstrates seamless antenna-to-transceiver signal transitions on panel-scale processed ultra-thin glass-based 5G modules with impedance-matched transmission lines and microvias with high-precision low-loss re-distribution layer design an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fddd74c4bb6c32d7de2087f0163d47d
https://doi.org/10.1109/ectc.2018.00304
https://doi.org/10.1109/ectc.2018.00304
Autor:
P. Markondeya Raj, Venkatesh Sundaram, Tomonori Ogawa, Tong-Hong Lin, Rao Tummala, Atom Watanabe, Manos M. Tentzeris
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
This paper demonstrates six-metal-layer antenna-to-receiver signal transitions on panel-scale processed ultra-thin glass-based 5G module substrates with 50-Ω transmission lines and micro-via transitions in re-distribution layers. The glass modules c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2cda441ed6aa88c86189d19043d8938
https://doi.org/10.23919/icep.2018.8374698
https://doi.org/10.23919/icep.2018.8374698
Autor:
Tomonori Ogawa, Muhammad Ali, Atom Watanabe, Bijan Tehrani, Hiroyuki Matsuura, Rao Tummala, Jimmy Hester, Manos M. Tentzeris, P. Markondeya Raj, Venky Sundaram
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
High-performance and ultra-miniaturized mm-wave building block structures were demonstrated on panel-scale processed 3D glass packages for high-speed 5G communication standards at 28 and 39 GHz bands. To demonstrate the benefits of glass for 5G commu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9006366782fbfb23b3a2d334ff8afa8e
https://doi.org/10.1109/ectc.2017.329
https://doi.org/10.1109/ectc.2017.329
Autor:
Ting-Chia Huang, Rao Tummala, Bruce C. Chou, Vanessa Smet, Yoichiro Sato, Tailong Shi, Venky Sundaram, Hiroyuki Matsuura, Satomi Kawamoto, Kadappan Panayappan, Tomonori Ogawa
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
This paper presents the design, fabrication, assembly, and characterization of a fully-integrated single-chip glass BGA package at 40/80 µm off-chip I/O pitch with multilayered wiring and through-package-vias (TPVs) at 160 µm pitch. The designed te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a6b252cd5c9779204733de719651b7b
https://doi.org/10.1109/ectc.2016.372
https://doi.org/10.1109/ectc.2016.372