Zobrazeno 1 - 10 of 19 pro vyhledávání: '"Tomonori Minegishi"'
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Ultra-fine Cu Wiring Surrounded by Electroless-Plated Ni: Effective Structure for High Insulation Reliable Wiring Applicable to Panel Level Fabrication
Autor: Kazuhiko Kurafuchi, Masaya Toba, Kazuyuki Mitsukura, Tomonori Minegishi, Yoshinori Ejiri
Publikováno v: International Symposium on Microelectronics. 2017:000742-000746
Panel level packages such as 2.1D organic interposer and fan-out packages have been attracting the attention as a low cost substrate technology with high density fine wiring layers which interconnect multiple die set side by side. The Cu trench wirin
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::9fa7cc9139413c6389a5e9095a1b3b08
https://doi.org/10.4071/isom-2017-thp41_007
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3
Highly Reliable Cu Wiring Layer of 1/1 μm Line/Space Using Newly Designed Insulation Barrier Film
Autor: Kazuyuki Mitsukura, Masaya Toba, Shinichiro Abe, Kazuhiko Kurafuchi, Tomonori Minegishi
Publikováno v: International Symposium on Microelectronics. 2017:000140-000145
The interposer or fan-out packaging technology with ultra-fine line/space has been required in order to achieve high density interconnection between chips with low cost. In this paper, we propose the iBF (insulation barrier film) to satisfy the insul
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::9974397416a876d6daf8a0cd5a958ae4
https://doi.org/10.4071/isom-2017-tp53_003
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6
Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer
Autor: Kazuyuki Mitsukura, Masaya Toba, Kousuke Urashima, Yoshinori Ejiri, Kenichi Iwashita, Tomonori Minegishi, Kazuhiko Kurafuchi
Publikováno v: Journal of Microelectronics and Electronic Packaging. 14:26-31
An organic interposer technology with ultrafine line and space is required to achieve high-density interconnection between chips. In this article, we propose a high reliability, ultrafine trench wiring process. Currently, trench wiring is made by las
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::db53d5856e36d8d5f2563a9f6b2c7032
https://doi.org/10.4071/imaps.348184
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7
Proposal of Ultra-fine and High Reliable Trench Wiring Process for Organic Interposer
Autor: Kazuyuki Mitsukura, Kenichi Iwashita, Kazuhiko Kurafuchi, Yoshinori Ejiri, Tomonori Minegishi, Kousuke Urashima, Masaya Toba
Publikováno v: International Symposium on Microelectronics. 2016:000165-000170
An organic interposer technology with ultra-fine line and space is required in order to achieve high density interconnection between chips. In this paper we propose a high reliability, ultra-fine trench wiring process. Current trench wiring is made b
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::8ce4b4878c8042665a49eaa72bab8c0a
https://doi.org/10.4071/isom-2016-wa23
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9
Stretchable insulating material for IoT devices
Autor: Satoshi Uehara, Tomoaki Shibata, Otake Shunsuke, Tomonori Minegishi, Kazuyoshi Tendo
Publikováno v: 2016 IEEE CPMT Symposium Japan (ICSJ).
This paper reports a newly developed UV-curable and film-shaped insulating material for IoT devices that require stretchability. The material features large stretch ability, high transparency, low moisture permeability and good embedding property. An
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ca290b58a4b15ff2e110bd296dd298e1
https://doi.org/10.1109/icsj.2016.7801257
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10
Improvement in Chemical Resistance of Positive-tone Photodefinable Poly(benzoxazole) Materials
Autor: Masayuki Ohe, Konno Taku, Nakamura Yuki, Ono Keishi, Tomonori Minegishi, Takeharu Motobe, Masashi Kotani
Publikováno v: Journal of Photopolymer Science and Technology. 23:477-482
Polyimide (PI) and poly(benzoxazole) (PBO) materials are widely used as stress buffer and rewiring cover layers to improve the reliability of semiconductors. With recent advances in this area, the chemical resistance of PI and PBO to organic solvents
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1a6f338c330fd73574c6dd4ecf17e3e7
https://doi.org/10.2494/photopolymer.23.477
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