Výsledky vyhledávání - "Tomoko Monda"

Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis

Autor: Yousuke Hisakuni, Akira Kano, Hideaki Uehara, Tomoko Monda, Junko Hirokawa, Osamu Nishimura, Kenji Hirohata, Toshinobu Ito, Shohei Takami, Kiyokazu Sato

Publikováno v: Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters.

A quench is the transition from a superconducting state to a normal conducting state. Elucidating the mechanism of quenching caused by mechanical disturbances (training quench) requires a detailed understanding of the stress state in the coil during

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5dc4d3878330bd525e2f826b707992ae
https://doi.org/10.1115/imece2022-94914

Zobrazit plný text záznamu

Prognostic Health Monitoring Method for Thermal Fatigue Failure of Power Modules Based on Finite Element Method-Based Lagrangian Neural Networks

Autor: Akira Kano, Tomoko Monda, Tomoyuki Suzuki, Hideaki Uehara, Tomoya Fumikura, Kenji Hirohata

Publikováno v: Volume 13: Safety Engineering, Risk, and Reliability Analysis; Research Posters.

Prognostic health monitoring technologies for power electronic systems assess their performance degradation, load histories, and degrees of fatigue in order to increase maintenance effectiveness, reliability design methods, and equipment availability

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::d19b6bbd6f252c37a20a3d21dcf6c027
https://doi.org/10.1115/imece2021-70783

Zobrazit plný text záznamu

Prognostic Health Monitoring Method For Thermal Fatigue Failure Of Power Module Solder Joints Using The Grain Boundary Sliding Model

Autor: H. Uehara, Kenji Hirohata, Tomoko Monda, Akira Kano, T. Fumikura

Publikováno v: 2021 International Conference on Electronics Packaging (ICEP).

Prognostic health monitoring technologies, which can evaluate performance degradation, load history, and degree of fatigue, have the potential to improve the effective maintenance, reliability design methods, and availability under improper use condi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::0a5921465f9c67a368f25a905d2ab7cb
https://doi.org/10.23919/icep51988.2021.9451981

Zobrazit plný text záznamu

Damage Path Simulation of Solder Bumps Under Mechanical Fatigue Tests

Autor: Hiroyuki Takahashi, Minoru Mukai, Tomoko Monda, Takashi Kawakami, Kenji Hirohata

Publikováno v: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 73:1431-1437

Fatigue life prediction of solder joints is one of the most important areas of research in the development of reliable electronic packages. In the present study, the new method of estimating the crack propagation, called 'damage path simulation', was

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ed490af966501a092993676bf67827f5
https://doi.org/10.1299/kikaia.73.1431

Zobrazit plný text záznamu

Damage Path Simulation of Solder Joints

Autor: Kenji Hirohata, Takashi Kawakami, Minoru Mukai, Tomoko Monda, Kuniaki Takahashi, Hiroyuki Takahashi

Publikováno v: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 72:1364-1369

Fatigue life prediction of solder joints is one of the most important areas of research in the development of reliable electronic packages. In the present study, a new method of estimating the crack propagation, which is based on finite element analy

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::7b108fc4578316716b0c146abd063366
https://doi.org/10.1299/kikaia.72.1364

Zobrazit plný text záznamu

A Study of Sizing in SMC (2nd Report, Effect of Sizing on Strength)

Autor: Satoshi Somiya, Tomoko Monda

Publikováno v: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 71:551-558

In previous report it was revealed that sizing didn't spread in resin and much sizing was around strands. In this study effect of sizing around strands on tensile strength and fatigue strength of SMC was investigated. Six types of SMC differing in am

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::49cde2393f97525fffdb51dfc67c9aeb
https://doi.org/10.1299/kikaia.71.551

Zobrazit plný text záznamu

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

Autor: Kenji Hirohata, Minoru Mukai, Tomoko Monda, Takahiro Omori, Yousuke Hisakuni

Publikováno v: Volume 10: Micro- and Nano-Systems Engineering and Packaging.

Continuing improvements in both capacity and miniaturization of electronic equipment such as solid state drives (SSDs) are spurring demand for high-density packaging of NAND-type flash memory mounted on SSD printed circuit boards. High-density packag

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::354409f8e006a0d4537b010e6c1efad6
https://doi.org/10.1115/imece2013-65317

Zobrazit plný text záznamu

Large-Scale Damage Path Simulation for Solder Joints in a BGA Package

Autor: Minoru Mukai, Kenji Hirohata, Takahiro Omori, Tomoko Monda

Publikováno v: Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes.

There is high demand for fatigue life prediction of solder joints in electronic packages such as ball grid arrays (BGAs). A key component of fatigue life prediction technology is a canary device, which warns of the impending risk of failure through l

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::739104cdc796a09ed6b05c4d66066c5b
https://doi.org/10.1115/ipack2013-73161

Zobrazit plný text záznamu

Vyhledávací nástroje:

Upřesnit hledání