Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Tomoaki Kuroishi"'
Autor:
Yu Sasaki, Manabu Yasuoka, Yoshiharu Mutoh, Yukio Miyashita, Takanori Watanabe, Jin-Quan Xu, Tomoaki Kuroishi
Publikováno v:
JSME International Journal Series A. 46:335-340
Scratch tests were carried out on TiC and TiN coatings which had been deposited by PVD (Physical Vapor Deposition) and CVD (Chemical Vapor Deposition) techniques. The critical load L c was detected by the acoustic emission method (AE) and also by the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8bdff0b5eee3dd14651404e38062bc7b
https://doi.org/10.1299/jsmea.46.335
https://doi.org/10.1299/jsmea.46.335
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 68:909-915
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6dc66f08d3790a182a146dcfddf8ba35
https://doi.org/10.1299/kikaia.68.909
https://doi.org/10.1299/kikaia.68.909
Autor:
Tomoaki Kuroishi, Yu Sasaki, Jin Quan Xu, Yoshiharu Mutoh, Manabu Yasuoka, Takanori Watanabe, Yukio Miyashita
Publikováno v:
The Proceedings of the JSME Materials and Processing Conference (M&P). :254-259
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8d458a1df6d8549d1abc1f41d557bd7
https://doi.org/10.1299/jsmeintmp.10.2.254
https://doi.org/10.1299/jsmeintmp.10.2.254
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
In the present paper, a reliability of a single-sided chip-size package (CSP) manufactured using a non-conductive adhesive stud bump direct interconnection method is investigated. The reliability of the CSP is closely related with normal stress betwe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b99e663258f4e592ae5d43c120738c8e
https://doi.org/10.1115/ipack2005-73096
https://doi.org/10.1115/ipack2005-73096
Publikováno v:
The Proceedings of The Computational Mechanics Conference. :783-784
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b0700ee44fc07d655f088562de29c779
https://doi.org/10.1299/jsmecmd.2004.17.783
https://doi.org/10.1299/jsmecmd.2004.17.783
Publikováno v:
Proceedings of the 1992 Annual Meeting of JSME/MMD. 2000:235-236
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98f44c44535aa71c5e539eca5e2f058c
https://doi.org/10.1299/jsmezairiki.2000.0_235
https://doi.org/10.1299/jsmezairiki.2000.0_235