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Publikováno v:
IEEE Transactions on Device and Materials Reliability. 17:585-592
Glass substrates have gained increasing attention for packaging due to their ideal material properties; however, the brittle nature of glass poses a challenge. This paper focuses on glass cracking due to dicing-induced defects and redistribution laye
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f079a4a36ab0e65a39f4025a9a23e8e
https://doi.org/10.1109/tdmr.2017.2738625
https://doi.org/10.1109/tdmr.2017.2738625
