Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Tomo Odashima"'
Autor:
Shuta Nagata, Tetsu Tanaka, Zhengyang Qian, Yuki Susumago, Bang Du, Noriyuki Takahashi, Takafumi Fukushima, Tomo Odashima, Chidai Shima, Hisashi Kino
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1419-1422
Typical die shift is beyond several tens micrometers or more, which is a serious problem on advanced fan-out wafer-level packaging (FOWLP), to give inevitable misalignment errors in the subsequent photolithography processes for fine-pitch redistribut
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f83f747918ea66c73de31d734584c4bd
https://doi.org/10.1109/tcpmt.2020.3009640
https://doi.org/10.1109/tcpmt.2020.3009640
Autor:
Zhe Wang, Tomo Odashima, Takafumi Fukushima, Yuki Susumago, Hisashi Kino, Ikumi Ozawa, Noriyuki Takahashi, Tetsu Tanaka
Publikováno v:
2021 IEEE International Interconnect Technology Conference (IITC).
In order to fabricate a wearable flexible display as a flexible hybrid electronic (FHE) device with micro-LED dies, we demonstrate multi-level metallization on an elastomer using die-first fan-out wafer-level packaging (FOWLP). The elastic substrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49170c0d870f4ae8abc7519f5da3dc7b
https://doi.org/10.1109/iitc51362.2021.9537540
https://doi.org/10.1109/iitc51362.2021.9537540
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
We have reported a new flexible hybrid electronics (FHE) whose structure is consisting of heterogeneous small/thin/rigid chiplets embedded in 2D molded polymeric substrates such as PDMS and hydrogel on which fine-pitch fanout RDLs are formed by die-f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::990cfb1edbbd4eec35752a0d8eb000b5
https://doi.org/10.1109/ectc32696.2021.00089
https://doi.org/10.1109/ectc32696.2021.00089
Autor:
Hisashi Kino, Hiroki Hanaoka, Takafumi Fukushima, Masatsugu Ichikawa, Tomo Odashima, Yuki Susumago, Tetsu Tanaka
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
This paper deals with a flexible 3D-IC system fabrication methodology. Mini-LEDs and 3D-IC chiplets divided from a large 3D-IC with Cu-TSVs are embedded in an elastomer PDMS based on die-first FOWLP for heterogeneously integrating them into Smart Ski
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::37e2e1675acfebc6fdc0928bec4fb25e
https://doi.org/10.1109/ectc32696.2021.00017
https://doi.org/10.1109/ectc32696.2021.00017
Autor:
Tomo Odashima, Yuki Susumago, Qian Zhengyang, Noriyuki Takahashi, Shuta Nagata, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Publikováno v:
Extended Abstracts of the 2020 International Conference on Solid State Devices and Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4065665cac1a892d3d9e65227b773a0
https://doi.org/10.7567/ssdm.2020.c-6-02
https://doi.org/10.7567/ssdm.2020.c-6-02