Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Tomiyo Ema"'
Autor:
Tomiyo Ema
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 7:372-375
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b50aa5941e332509cff64040ab71c423
https://doi.org/10.5104/jiep.7.372
https://doi.org/10.5104/jiep.7.372
Autor:
Takashi Yui, Hajime Honma, Kazuto Nishida, Chie Sasaki, Nobuya Matsumura, Hideo Koguchi, Kouzou Takada, Tomiyo Ema, Izumi Okamoto, Kazumichi Shimizu, Kouji Abe
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 5:693-700
A stacked device called SEP (System Embedded Package) was developed to drastically increase LSI density relative to its area on the circuit board. This was achieved by fabricating an LSI package in a stacked structure. This device has been applied to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2cd741a3028f4a1c8f2d45f580acf2eb
https://doi.org/10.5104/jiep.5.693
https://doi.org/10.5104/jiep.5.693
Autor:
Yuichi Fujino, Keisuke Suwa, Hiroshi Hojo, Yoshifumi Suzuki, Tomiyo Ema, Yoshihiro Kikuchi, Takuyo Kogure, Yasubumi Honma, Yasushi Yamao
Publikováno v:
The Journal of the Institute of Image Information and Television Engineers. 56:716-741
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f375ce3d03800e0295c21aa0694454c
https://doi.org/10.3169/itej.56.716
https://doi.org/10.3169/itej.56.716
Autor:
Tomiyo Ema
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 2:495-499
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7449ab519b93b85f00cbe3ec2a73c1e6
https://doi.org/10.5104/jiep.2.495
https://doi.org/10.5104/jiep.2.495