Zobrazeno 1 - 10
of 128
pro vyhledávání: '"Tomio IWASAKI"'
Autor:
Tomohiro Tabata, Matahiro Komuro, Yusuke Asari, Shinya Tamura, Masafumi Nojima, Tomio Iwasaki, Shohei Terada
Publikováno v:
AIP Advances, Vol 14, Iss 6, Pp 065217-065217-6 (2024)
Nitrogen-martensitic phase (Fe0.8Co0.2)8N was successfully synthesized by using an industrially suitable gas-nitriding process of a bulk foil. So far, the nitrogen-martensitic phase of the bulk material has not been synthesized at such a high Co cont
Externí odkaz:
https://doaj.org/article/26321a96c0d747dc9f9daddc507df9ef
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 81, Iss 824, Pp 15-00018-15-00018 (2015)
A Kriging-based method for efficiently searching materials was used to select additive elements in lead-free solders that are effective for suppressing the grain-boundary diffusion, which is the cause of smaller breaking elongation than lead-containe
Externí odkaz:
https://doaj.org/article/8d860fdaa4944a5db8a8df75911bf57a
Publikováno v:
Mechanical Engineering Journal, Vol 1, Iss 4, Pp SMM0032-SMM0032 (2014)
Nanotechnology devices with strong adhesion strength are required due to the miniaturization and reduction of the thickness of electronic devices. This paper describes a technique to select a silane coupling agent effective for obtaining the strong a
Externí odkaz:
https://doaj.org/article/2b0f50bd98fc4ab2bad06e8cab4c2cd7
Publikováno v:
Polymer Journal. 55:289-294
Publikováno v:
Polymer Journal. 53:1439-1449
Peptides with strong binding affinities for poly(methyl methacrylate) (PMMA) resin were designed by use of materials informatics technology based on molecular dynamics simulation for the purpose of covering the resin surface with adhesive peptides, w
Autor:
Tomio Iwasaki
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 24:340-345
Autor:
Tomio Iwasaki
Publikováno v:
Journal of the Society of Materials Science, Japan. 70:361-368
Autor:
Tomio Iwasaki
Publikováno v:
Journal of the Society of Materials Science, Japan. 70:336-343
Autor:
Tomio Iwasaki
Publikováno v:
Journal of The Surface Finishing Society of Japan. 72:91-95
Autor:
Tomio Iwasaki
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).