Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Tomas Webers"'
Autor:
Jaber Derakhshandeh, Douglas Charles La Tulipe, Giovanni Capuz, Vladimir Cherman, Carine Gerets, Tom Cochet, Ehsan Shafahian, Inge De Preter, Geraldine Jamieson, Tomas Webers, Eric Beyne, Gerald Beyer, Andy Miller
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Autor:
Jaber Derakhshandeh, Eric Beyne, Gerald Beyer, Giovanni Capuz, Vladimir Cherman, Inge De Preter, Carine Gerets, Ehsan Shafahian, Koen Kennes, Geraldine Jamieson, Tom Cochet, Tomas Webers, Bert Tobback, Geert Van der Plas, Douglas Charles La Tulipe, Alain Phommahaxay, Andy Miller
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Autor:
Lin Hou, Teng Wang, Jaber Derakhshandeh, G. Beyer, Kenneth June Rebibis, Carine Gerets, Geraldine Jamieson, Eric Beyne, John Slabbekoorn, Inge De Preter, Pieter Bex, Andy Miller, Vikas Dubey, Anne Jourdain, Fumihiro Inoue, Tomas Webers, Giovanni Capuz, Samuel Suhard
Publikováno v:
3DIC
Processing of bump-less or embedded microbumps is introduced in this paper as an approach which enables scaling microbumps for below 10um pitches. Landing wafer is standard damascene process and in top wafer bumps are embedded in a soft backed polyme
Autor:
Anne Jourdain, Kenneth June Rebibis, John Slabbekoorn, Lin Hou, Jaber Derakhshandeh, Teng Wang, G. Beyer, Geraldine Jamieson, Fumihiro Inoue, Carine Gerets, Eric Beyne, Vikas Dubey, Kevin Vandersmissen, Tomas Webers, Andy Miller, Giovanni Capuz, Nancy Heylen, Samuel Suhard, Goedele Potoms, Inge De Preter
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
In this paper a bump-less process is introduced in order to further scale down the pitch of microbumps. Electrical resistance measurement, Cross section SEM and mechanical characterizations show successful 3D stacking using proposed method.
Publikováno v:
Scopus-Elsevier
Most reliability studies, carried out for characterising new Pb-free solder material, put main focus on the thermal-mechanical behaviour of the solder joints. However, it is seen that electro-migration has a big impact on the intermetallic formation
Publikováno v:
EMBC
Future cochlear implants demand a higher density of stimulation sites (electrodes) and enhanced functionality (e.g. feedback information). The current generation of implanted cochlear prostheses is making use of a completely "passive scheme" and cann