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pro vyhledávání: '"Tomas Hmcir"'
Publikováno v:
2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
An advanced sample preparation protocol using Xe+ Plasma FIB for cross-sections wider than 400 μm is proposed. Challenging samples such as a BGA (CSP) or chip in a package often suffer from FIB milling artifacts. The results are unsatisfactory mainl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc63d5e2982e2cfbb9f2f0e207f0d4e8
https://doi.org/10.1109/ipfa.2017.8060168
https://doi.org/10.1109/ipfa.2017.8060168
