Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Tom Quoc Lao"'
Autor:
Douglas Lodgson, Tom Quoc Lao, YiYi Ma, Marco Del, Nicolo' Manca, Roseanne Duca, Alex Gritti, David Cheng
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In the field of MEMS sensors, package plays a primary role since it strongly affects device behavior and performance. Depending on the application and mission profile, design and package technology need to be targeted in order to fit the best the giv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84d6a9f81cb2ff1232856fd97a3f9cfe
https://doi.org/10.1109/ectc32862.2020.00075
https://doi.org/10.1109/ectc32862.2020.00075
Publikováno v:
1997 Proceedings 47th Electronic Components and Technology Conference.
Thermal characteristics of flip chip on FR4 boards are presented. The thermal resistances are determined for different die and board constructions, underfill material, and heat sink applications. Thermal paths are analyzed to understand the flip chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e87375b32b55eac867335867f98902fc
https://doi.org/10.1109/ectc.1997.606273
https://doi.org/10.1109/ectc.1997.606273