Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Tom Cochet"'
Autor:
Carine Gerets, Jaber Derakhshandeh, Ehsan Shafahian, Tom Cochet, Douglas Charles La Tulipe, Gerald Beyer, Andy Miller, Eric Beyne
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Autor:
Jaber Derakhshandeh, Douglas Charles La Tulipe, Giovanni Capuz, Vladimir Cherman, Carine Gerets, Tom Cochet, Ehsan Shafahian, Inge De Preter, Geraldine Jamieson, Tomas Webers, Eric Beyne, Gerald Beyer, Andy Miller
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Autor:
Jaber Derakhshandeh, Eric Beyne, Gerald Beyer, Giovanni Capuz, Vladimir Cherman, Inge De Preter, Carine Gerets, Ehsan Shafahian, Koen Kennes, Geraldine Jamieson, Tom Cochet, Tomas Webers, Bert Tobback, Geert Van der Plas, Douglas Charles La Tulipe, Alain Phommahaxay, Andy Miller
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Autor:
Ehsan Shafahian, Carine Gerets, Eric Beyne, Masataka Maehara, Vladimir Cherman, G. Jamieson, Pieter Bex, Jaber Derakhshandeh, Inge De Preter, Julien Bertheau, Andy Miller, Fumihiro Inoue, T. Webers, Melina Lofrano, Tom Cochet, Lin Hou, Giovanni Capuz, Geert Van der Plas, Gerald Beyer, Douglas Charles La Tulipe
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this paper full integration flow for a low temperature (150°C) and high throughput die to wafer bonding method is introduced for microbumps pitches down to $10 \mu \mathrm{m}$ . The impact of Co plating chemistry, Sn thickness, annealing temperat
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
In 3D stacking chips, interconnections play an important role and selection of right materials is very significant. In this paper, a systematic study is done to characterize metal oxide growth rate with time and temperature for three most used UBM (u
Autor:
Alice Guerrero, Tom Cochet, Arnita Podpod, Hariharan Arumugam, Koen Kennes, Qi Wu, Kim Yess, Erick Sleeckx, Kim Arnold, Julien Bertheau, Andy Miller, Gerald Beyer, Eric Beyne, Alain Phommahaxay, Pieter Bex, Kenneth June Rebibis, Xiao Liu
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
Next-generation temporary bonding adhesive material is introduced into imec's high interconnect density flip chip on fan-out wafer-level package (FC FOWLP) concept [1], [2]. After molding on silicon substrates, an ultralow die shift with an average o
Autor:
John Slabbekoorn, Jaber Derakhshandeh, Melina Lofrano, Julien Bertheau, Andy Miller, Lin Hou, Fumihiro Inoue, M. Honore, Fabrice Duval, Vladimir Cherman, Kenneth June Rebibis, F. Beirnaert, Gerald Beyer, G. Jamieson, Giovanni Capuz, Samuel Suhard, C. Heyvaert, Nancy Heylen, I. De Preter, Carine Gerets, Eric Beyne, T. Webers, Alain Phommahaxay, G. Van der Plas, Pieter Bex, Tom Cochet
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In this paper a novel solder-based die-to-die or wafer-to-wafer interconnect approach is introduced. This technique allows for microbump interconnects with different diameters on a single die and allows for pitch scaling down to 5μm A metal damascen
Autor:
Tom Cochet, Jaber Derakhshandeh, Pieter Bex, Carine Gerets, Andy Miller, Eric Beyne, Kenneth June Rebibis, Vladimir Cherman, Melina Lofrano, Gerald Beyer
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
In this paper optimization process of D2W (Die to Wafer) TCB (Thermal Compression Bonding) stacking for thinned, warped and large dies are investigated. TCB related characteristics of WLUF (Wafer Level Underfill) is studied in detail by both analytic