Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Tom Chung"'
Publikováno v:
Frontiers in Ecology and Evolution, Vol 9 (2021)
Along the East Asian-Australasian flyway (EAAF), waterbirds are threatened by a wide range of human activities. Studies have shown that wintering populations of many species have declined in Australia and Japan; however, long term data along China’
Externí odkaz:
https://doaj.org/article/cf8ce627ce6a45d9972c67d5e40a3f87
Autor:
Tom Chung
Tudo o que queremos está ao nosso alcance; para atingir um objetivo basta o simples fato de sonhar e ir atrás desse sonho. Para conseguirmos isto, temos que passar por cima de medos, costumes, regras, crenças e nos reeducarmos no sentido de buscar
Akademický článek
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Publikováno v:
Environmental and Molecular Mutagenesis. 52:664-672
We examined genotoxicity and DNA damage response in HepG2 cells following exposure to benzidine. Using the Comet assay, we showed that benzidine (50–200 μM) induces DNA damage in HepG2 cells. DNA damage signaling pathway-based PCR arrays were used
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::55b7ab119586b19bc87d9d413a0bd8c8
https://doi.org/10.1002/em.20669
https://doi.org/10.1002/em.20669
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Package-on-Package (PoP) is one of the major 3D packaging approaches. It vertically combines discrete memory and logic Ball Grid Array (BGA) packages, where one package rests on the top of the other. Recently, PoP technologies have attracted more int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef31f8f0211af8f8701290061f2ab757
https://doi.org/10.1109/ectc.2010.5490682
https://doi.org/10.1109/ectc.2010.5490682
Publikováno v:
2010 Prognostics and System Health Management Conference.
The package-on-package (PoP) as one of the 3D packaging solutions has been rapidly used in portable products due to its flexibility and testability, but the PoP packaging industry encounters more manufacturability and reliability related issues durin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1920c86cabfb93f0a56d4f9476f316f6
https://doi.org/10.1109/phm.2010.5414595
https://doi.org/10.1109/phm.2010.5414595
Publikováno v:
2009 Asia Pacific Microwave Conference.
We present a thin film on modified ceramic (TFoMC) technique in this work to achieve high-accuracy and high-uniformity design. The integrated passive devices (IPDs), including capacitors, inductors, band-pass filters and Baluns, are realized based on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26047c910381f9864bf9d94a215b0fba
https://doi.org/10.1109/apmc.2009.5384456
https://doi.org/10.1109/apmc.2009.5384456
Publikováno v:
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS).
We have developed a thin-film on modified ceramic (TFoMC) technology in this work to achieve high-density, high-accuracy and high-uniformity substrate technology for RF-related applications. Integrated passive devices (IPDs), including capacitors, in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::692482ac0416985a25880905c2eb07fa
https://doi.org/10.1109/edaps.2009.5403984
https://doi.org/10.1109/edaps.2009.5403984
Publikováno v:
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
In this paper, we have developed a Thin Film on Modified Ceramic (TFoMC) technology which provides not only a low-cost but also high-performance solution, especially for wireless local-area network (WLAN) related applications. To begin with, a warpag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::649b1fd4fb6c0faf7cd263a6777430fb
https://doi.org/10.1109/impact.2009.5382120
https://doi.org/10.1109/impact.2009.5382120
Publikováno v:
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
For transferring R&D efforts into real product manufacturing, proper product reliability qualification is one of the most critical considerations during product development in addition to assembly yield prediction. It is particularly important for au
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7bd4cf4708f02a76f3bc59fdc44397d
https://doi.org/10.1109/icept.2008.4606936
https://doi.org/10.1109/icept.2008.4606936