Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Tomáš Morávek"'
Autor:
Ryan Brooke, Duyao Zhang, Dong Qiu, Mark A. Gibson, Edwin LH Mayes, Tomáš Morávek, Nithin Balaji V.I., Narendraraj Chandran, Rajarshi Banerjee, Mark Easton
Publikováno v:
Materials & Design, Vol 244, Iss , Pp 113176- (2024)
Novel ternary titanium alloys with a bainitic microstructure have been designed specifically for additive manufacturing (AM). The Ti-xCu-yFe alloys take advantage of constitutional supercooling to suppress the growth of large columnar grains usually
Externí odkaz:
https://doaj.org/article/0fa028e468cc49ca95999cec600100e7
Autor:
Václav Pouchlý, David Pavliňák, Karel Maca, Jozef Ráheľ, Tomáš Spusta, Martina Ilčíková, Tomáš Morávek
Publikováno v:
Journal of the European Ceramic Society. 39:1297-1303
Submicron Al2O3 powders were activated by Diffuse Coplanar Surface Barrier Discharge (DCSBD) plasma. The influence of the plasma treatment on the powder properties and their impact on the microstructure of dry and wet shaped ceramics were investigate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df095035bd120726f88ec14c60ff9d8b
https://doi.org/10.1016/j.jeurceramsoc.2018.11.022
https://doi.org/10.1016/j.jeurceramsoc.2018.11.022
Publikováno v:
Powder Technology. 340:570-577
Nanofluids are nowadays representing an exciting tool with significant impact and tremendous potential in several industrial applications. In the present paper, we focus our attention on the tunability of the electrical and dielectric properties of a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c185164d636688c25de753f68593131b
https://doi.org/10.1016/j.powtec.2018.09.036
https://doi.org/10.1016/j.powtec.2018.09.036
Autor:
Jürgen Gluch, Chandran Narendraraj, Ehrenfried Zschech, Tomáš Morávek, Miloš Hrabovský, Uwe Mühle, Martin Gall
Publikováno v:
International Symposium for Testing and Failure Analysis.
As the new generation of microelectronics is pushed into smaller spaces and the yield production is pushing to lower the unoccupied spaces on chips, the local variation of stress has an influence on the component’s performance. This stress comes ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a31e7e1d3994334097adce3ccb00b9c
https://doi.org/10.31399/asm.cp.istfa2019p0223
https://doi.org/10.31399/asm.cp.istfa2019p0223
Autor:
Karel Maca, Jozef Ráheľ, Daniel Drdlik, Jaroslav Cihlář, Tomáš Morávek, Katarina Drdlikova, Monika Stupavská
Publikováno v:
Ceramics International. 44:9787-9793
The positive effect of plasma mediated treatment of powder fraction in water-based dispersion is a rather well documented fact. Despite its importance for ceramic processing, the applicability of plasma treatment of ceramic particles in a non-aqueous
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50a04cfec355524319d2129905ff8e8f
https://doi.org/10.1016/j.ceramint.2018.02.215
https://doi.org/10.1016/j.ceramint.2018.02.215
Autor:
David Děcký, Tomáš Morávek, Monika Stupavská, Pavel Král, Jozef Rahel, Rupert Wimmer, Jozef Kúdela, Petr Klímek
Publikováno v:
Composites Part B: Engineering. 90:188-194
Wood-plastic composite boards involving up to 30 wt. % of polyethylene terephthalate (PET) flakes were evaluated for its physical and mechanical properties – internal bonding strength, modulus of rupture and thickness swelling. It was found that th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64ad73cd1dd3f17917953b3201ee1ea5
https://doi.org/10.1016/j.compositesb.2015.12.019
https://doi.org/10.1016/j.compositesb.2015.12.019
Autor:
Ehrenfried Zschech, Tomáš Morávek, Chandran Narendraraj, Martin Gall, Jürgen Gluch, Uwe Mühle, Miloš Hrabovský
Publikováno v:
International Symposium for Testing and Failure Analysis.
In the vicinity of a through silicon via (TSV) used in 3D chip integration, the effect of dedicated strain engineering to enhance the carrier mobility in the channel of metal oxide semiconductor field effect transistors (MOSFETs) is superposed by a s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d2c644bba900a7be918c53450c6e47a4
https://doi.org/10.31399/asm.cp.istfa2018p0358
https://doi.org/10.31399/asm.cp.istfa2018p0358
Publikováno v:
Advanced Materials Research. 897:220-223
The paper presents results related to surface treatment of polypropylene fibres with intention to increase its performance in cement composite by exposing such fibres in cold plasma discharge. In was previously demonstrated that such treatment has be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c71c8aa447e52c1be60bd7978f012a1
https://doi.org/10.4028/www.scientific.net/amr.897.220
https://doi.org/10.4028/www.scientific.net/amr.897.220
Publikováno v:
The European Physical Journal D. 70
Microfilaments of dielectric barrier discharge are known for their multiple re-appearance at the same spot on dielectrics. This effect of localized re-appearance is driven by residual excited species and ions, surface charge deposited on the dielectr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49b29ef72bbc0e356cb00ea417e1bb5a
https://doi.org/10.1140/epjd/e2016-70061-5
https://doi.org/10.1140/epjd/e2016-70061-5
Publikováno v:
Plasma Sources Science and Technology. 27:105002
Electric field strength in diffuse coplanar barrier discharge in helium at atmospheric pressure, driven by AC voltage amplitude 1.5 kV, frequency 10 kHz), was measured by optical emission spectroscopy. Two helium singlet lines at 667.8 nm (He I) and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53b4d010945d4fda2a08a665457cd5fb
https://doi.org/10.1088/1361-6595/aade41
https://doi.org/10.1088/1361-6595/aade41