Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Tokihito Suwa"'
Publikováno v:
Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).
The sequential build-up process with photo-sensitive dielectric is a most significant candidate for achieving high density multilayer wiring substrates for low cost multichip modules. A high performance dielectric material is essential in order to ob
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f42a7981555ec96b4d0986f59f798f9c
https://doi.org/10.1109/icmcm.1998.670782
https://doi.org/10.1109/icmcm.1998.670782
Publikováno v:
2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225).
The photo-via build-up process is a most significant candidate for fabrication of high density multi-layer wiring boards for high density packaging using CSP and flip-chip direct attach. We have developed a new type of photo-sensitive dielectric. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::128c9287d23d0b7708ea41366d84b99f
https://doi.org/10.1109/iemtim.1998.704522
https://doi.org/10.1109/iemtim.1998.704522