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of 50
pro vyhledávání: '"Todd Salamon"'
Autor:
Qianying Wu, Todd Salamon
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:963-973
Passive two-phase cooling systems are an efficient and viable alternative to conventional air-cooling schemes for thermal management of electronics due to their capability of dissipating higher power densities with lower power consumption and noise l
Autor:
Todd Salamon, Banafsheh Barabadi, Evelyn N. Wang, Kevin R. Bagnall, Daniel F. Hanks, Ikuya Kinefuchi, Jay Sircar, Zhengmao Lu, Dion S. Antao
Publikováno v:
ACS Applied Materials & Interfaces. 12:7232-7238
Water is often considered as the highest performance working fluid for liquid–vapor phase change due to its high thermal conductivity and large enthalpy of vaporization. However, a wide range of industrial systems require using low surface tension
Publikováno v:
Journal of Electronic Packaging. 144
This study is focused on the experimental characterization of two-phase heat transfer performance and pressure drops within an ultracompact heat exchanger (UCHE) suitable for electronics cooling applications. In this specific work, the UCHE prototype
The main drivers contributing to the continued growth of network traffic include video, mobile broadband and machine-to-machine communication (Internet of Things, cloud computing, etc.). Two primary technologies that next-generation (5G) networks are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9129da45f29143dd2dee402f61e4b2ea
https://doi.org/10.1115/1.0003567v
https://doi.org/10.1115/1.0003567v
Autor:
Francois P. Faraldo, Todd Salamon, Filippo Cataldo, Raffaele L. Amalfi, John R. Thome, Ryan Enright, Jackson B. Marcinichen
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
This paper advances the work presented at ITHERM 2020 where a novel passive two-phase technology was introduced for more efficient cooling of datacenters compared to air-based cooling solutions (e.g. In-Room, In-Row, etc.). The proposed hybrid two-ph
Autor:
Todd Salamon
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1212-1227
This paper discusses challenges and opportunities for thermal management of information and communications technologies equipment, with a particular focus on telecommunications equipment. This paper identifies the key drivers for network traffic grow
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Passive two-phase, micro-channel cooling for thermal management of electronics represents an efficient and viable solution to augment conventional air-cooling systems with the potential for higher power dissipation densities, increased reliability, r