Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Todd J. Spencer"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:367-374
In this paper, air cavity transmission lines are integrated into printed circuit boards and packages to enable high-speed low-loss chip-to-chip communication. Microstripline and parallel plate structures with copper conductors separated by an air gap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1edbcb428598e9022b44bcc8f0136dd9
https://doi.org/10.1109/tcpmt.2011.2179045
https://doi.org/10.1109/tcpmt.2011.2179045
Autor:
Todd J. Spencer, Paul A. Kohl
Publikováno v:
Polymer Degradation and Stability. 96:686-702
The decomposition characteristics of poly(propylene carbonate) containing a photoacid generator have been studied. The influence of casting solvent, photoacid concentration and type, UV exposure dose, substrate surface, and ambient gas were included
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1308e9326efb886dc8a896d1c354ec51
https://doi.org/10.1016/j.polymdegradstab.2010.12.003
https://doi.org/10.1016/j.polymdegradstab.2010.12.003
Publikováno v:
Journal of Electronic Materials. 40:1350-1363
Incorporation of copper ions into poly(propylene carbonate) (PPC) films cast from γ-butyrolactone (GBL), trichloroethylene (TCE) or methylene chloride (MeCl) solutions containing a photo-acid generator is shown to stabilize the PPC from thermal deco
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6d8e57119eb8c22012468bc81567946
https://doi.org/10.1007/s11664-011-1518-z
https://doi.org/10.1007/s11664-011-1518-z
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 55:1919-1925
The fabrication of low-loss transmission line structures with an air dielectric layer is described. The channels are characterized at low frequency (10 and 100 kHz) using capacitance and loss tangent and at high frequency (500 MHz to 10 GHz) using -p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3bd71d6730eb7db5678554e0ab6e8d7c
https://doi.org/10.1109/tmtt.2007.904326
https://doi.org/10.1109/tmtt.2007.904326
Publikováno v:
ECS Transactions. 2:19-25
A copper-to-copper bonding process was developed for an all- copper, chip-to-substrate interconnect technology. High aspect ratio, polymer molds for electroplating were formed using a photodefinable polymer on both the chip and the substrate surfaces
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::462594712f8483eab58bf00de5381a7f
https://doi.org/10.1149/1.2408860
https://doi.org/10.1149/1.2408860
Publikováno v:
2009 59th Electronic Components and Technology Conference.
Chip-to-chip communication across conventional printed circuit boards is limited to low frequencies (a few GHz), thus limiting the aggregate bandwidth without the use of optics. Low-loss, air insulated transmission lines can extend the frequency rang
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d89e440d87967b55ec3639adad9a7803
https://doi.org/10.1109/ectc.2009.5074167
https://doi.org/10.1109/ectc.2009.5074167
Autor:
Paul F. Joseph, James D. Meindl, Todd J. Spencer, Hiren D. Thacker, B. Dang, D.C. Sekar, Muhannad S. Bakir, Calvin King
Publikováno v:
2008 International Interconnect Technology Conference.
A 3D-IC technology with integrated microchannel cooling is demonstrated in this paper. Fluidic interconnect network fabrication proceeds at the wafer-level, is compatible with CMOS processing and flip-chip assembly and requires four lithography steps
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99892d32800994bb43ff8cfe29f0a682
https://doi.org/10.1109/iitc.2008.4546911
https://doi.org/10.1109/iitc.2008.4546911
Publikováno v:
Science (New York, N.Y.). 320(5877)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::52953d47cf2e7a39e2ac1b85684e9422
https://pubmed.ncbi.nlm.nih.gov/18467580
https://pubmed.ncbi.nlm.nih.gov/18467580
Autor:
Paul A. Kohl, Todd J. Spencer
Publikováno v:
2007 IEEE International Interconnect Technology Conferencee.
The fabrication and characterization of low loss parallel plate and microstrip lines with an air dielectric layer is described. The lines are characterized by capacitance and loss tangent at 10 kHz and 100 kHz and by S-parameters up to 10 GHz. The in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::527cebdd87b0d2c128429de08256dcb0
https://doi.org/10.1109/iitc.2007.382344
https://doi.org/10.1109/iitc.2007.382344
Publikováno v:
Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005..
We present a novel CMOS compatible approach to fabricate on-chip microfluidic cooling channels using a spin-on sacrificial polymer material at wafer level. Deep trenches (>100 /spl mu/m) etched into the backside of an IC wafer were successfully fille
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e6cc4128a581bc0a455db690d0af40d
https://doi.org/10.1109/iitc.2005.1499971
https://doi.org/10.1109/iitc.2005.1499971