Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Todd F. Miller"'
Publikováno v:
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.
The paper presents a novel approach to evaluate and improve MEMS reliability even during design phase of new devices. Firstly, the shock induced failure mechanisms of breakage and stiction are characterized by test structures. The obtained results in
Publikováno v:
2010 IEEE Sensors.
As part of the reliability investigation, shock tests for first generation surface micro-machined devices have been performed which showed susceptibility regarding stiction at the stopper elements and breakage of adjacent anchor points to the substra
Autor:
Torsten Hauck, Todd F. Miller, David Lin, I. Schmadlak, G. Li, Vladimir Kolchuzhin, Jan Mehner
Publikováno v:
TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.
The paper is focused on the influence of packaging technologies on the performance of inertial MEMS sensors. System simulations of MEMS are vital to evaluate and optimize the interplay of transducer cells with the sensor electronics. Special emphasis
Publikováno v:
Micro-Electro-Mechanical Systems (MEMS).
Surface micromachining is becoming increasingly popular for microelectromechanical systems (MEMS) and a new application for this process technology is pressure sensors. Uncompensated surface micromachined piezoresistive pressure sensors were fabricat
Publikováno v:
SPIE Proceedings.
Pressure sensors serve a variety of automotive applications, some which may experience high levels of acceleration such as tire pressure monitoring. To design pressure sensors for high acceleration environments it is important to understand their sen
Publikováno v:
SPIE Proceedings.
This paper looks at the issues related to the integration of pressure sensors with the control circuit necessary to achieve the demands of increased performance measured by such parameters as linearity, resolution, accuracy and temperature sensitivit