Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Tobias Tiedje"'
Autor:
Klaus-Jurgen Wolter, Karlheinz Bock, Tobias Tiedje, Sebastian Lungen, Lukas Lorenz, Krzysztof Nieweglowski
Publikováno v:
Microelectronics Reliability. 84:121-126
This contribution discusses technology development for the realization of chip-to-chip interconnection based on flexible optical waveguides. Two approaches for optical coupling between waveguides and active devices are presented. Both approaches buil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e72b7122867586e4769384010145146
https://doi.org/10.1016/j.microrel.2018.03.020
https://doi.org/10.1016/j.microrel.2018.03.020
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
3D integration and additive technologies are an emerging field in electronic packaging, which becomes more and more established. A new technology approach is presented, aiming to build the package around the components. The components are embedded in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9498672f8120bbe96ec3749f7f93878b
https://doi.org/10.1109/estc.2018.8546417
https://doi.org/10.1109/estc.2018.8546417
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
The main challenge in 3D-additive packaging is the manufacturing of the conductive redistribution layer. In most state-of-the-art and recent research, conductive polymer and nanoparticle sinter inks are used to print the conductive layers. However, t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::51237e8f592eb83ceb774492f65a2b82
https://doi.org/10.1109/estc.2018.8546450
https://doi.org/10.1109/estc.2018.8546450
Autor:
Lukas Lorenz, Krzysztof Nieweglowski, Johann W. Bartha, Sebastian Killge, Sebastian Lungen, Tobias Tiedje, Sujay Charania, Karlheinz Bock
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
In this work we discuss optical coupling technologies for the manufacturing of out-of-plane optics integrated in planar waveguide for interposer-and board-level. Each technology is evaluated on a silicon interposer with optical dielectric through sil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abd1a812d92d43ed0445a74bf57d2918
https://doi.org/10.1109/ectc.2017.273
https://doi.org/10.1109/ectc.2017.273
Autor:
Krzysztof Nieweglowski, Marco Luniak, Karlheinz Bock, Tobias Tiedje, Martin Schubert, Sebastian Lungen
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
The fan-out wafer level package (FOWLP) became rapidly developed towards a major advanced packaging solution. This technology creates a mold cast to embed bare dies by compression molding. Subsequently this mold cast serves as a substrate for the red
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3856ba5cf006ddd30f55d851f259fe8
https://doi.org/10.1109/ectc.2017.276
https://doi.org/10.1109/ectc.2017.276
Autor:
Ronny Henker, Karlheinz Bock, Mahdi Khafaji, Laszlo Szilagyi, Guido Belfiore, Krzysztof Nieweglowski, David Schöniger, Frank Ellinger, Tobias Tiedje, Jan Pliva
To accommodate the growing demand on higher speeds, low latencies and low energy consumption, the interconnections within and between data centers are supposed to be implemented as optical fiber and waveguide interconnects in future. Optical fiber in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::96cca1a6ea507d8388152937660b4de1
https://tud.qucosa.de/id/qucosa:35149
https://tud.qucosa.de/id/qucosa:35149
Autor:
David Schöniger, Krzysztof Nieweglowski, Ronny Henker, Frank Ellinger, Karlheinz Bock, Tobias Tiedje
This paper discusses the technology development for integration of parallel optical interconnects on board-level, including the active and passive optical components as well as the electrical integrated circuitry. The inter-chip link is based on plan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::12e46f158c5b84fb9ee55659da2639c8
https://tud.qucosa.de/id/qucosa:35150
https://tud.qucosa.de/id/qucosa:35150
Publikováno v:
2016 39th International Spring Seminar on Electronics Technology (ISSE).
This work represents a new contact-free measurement method to investigate vibration loads on a printed circuit board (PCB) test vehicle excited by a shaker in a low temperature environment. The aim is the insitu data acquisition without effecting the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ae077be7eae5f0ccea02016948f008a
https://doi.org/10.1109/isse.2016.7563196
https://doi.org/10.1109/isse.2016.7563196