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pro vyhledávání: '"Tito Verano"'
Autor:
Wingshenq Wong, Yiyi Ma, Kim-yong Goh, Tito Verano, Raquel Fundan, Xueren Zhang, Loic Pierre Louis Renard
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
As microelectronics is moving towards miniaturization, function integration and cost reduction, the device itself is becoming smaller while keeping same or even more functions. Silicon die with area less than 2×2 mm2 is common. This poses challenges
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab9b7ac77c6583178aac6d951ef2675a
https://doi.org/10.1109/eptc.2014.7028402
https://doi.org/10.1109/eptc.2014.7028402
