Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Tingshen Lan"'
Publikováno v:
IEEE Access, Vol 8, Pp 192867-192879 (2020)
To fully utilize the dynamic reconfigurability of digital microfluidic biochips, most of electrodes would be shared by different droplets. Thus, contaminations caused by liquid residues among droplets are inevitable which lead to lethal errors in bio
Externí odkaz:
https://doaj.org/article/daa5bf9017934e208a7989d930e842a2
Publikováno v:
IEEE Access, Vol 8, Pp 192867-192879 (2020)
To fully utilize the dynamic reconfigurability of digital microfluidic biochips, most of electrodes would be shared by different droplets. Thus, contaminations caused by liquid residues among droplets are inevitable which lead to lethal errors in bio
Autor:
Tingshen Lan, Yao-Wen Chang, Xingquan Li, Jianli Chen, Lei He, Wenxing Zhu, Jun Yu, Senhua Dong
Publikováno v:
ICCAD
Metal fill insertion has become an essential step to reduce dielectric thickness variation and improve pattern uniformity, which is important in mitigating process variations, thereby achieving better manufacturing yield. However, metal fills could i