Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Tingnan Yan"'
Autor:
Hongtian Li, Shiyu Zhou, Jianwei Zhao, Tingnan Yan, Yuxiao Du, Huanfu Zhou, Yongping Pu, Dawei Wang
Publikováno v:
Journal of Advanced Dielectrics, Vol 13, Iss 01 (2023)
In this work, novel (1 [Formula: see text])(0.75Na[Formula: see text]Bi[Formula: see text]TiO3)-0.25Sr(Zr[Formula: see text]Sn[Formula: see text]Hf[Formula: see text]Ti[Formula: see text]Nb[Formula: see text])O3-[Formula: see text]NaNbO3 (NBT-SZSHTN-
Externí odkaz:
https://doaj.org/article/f2433a2d7259403f8a7351049bcc3507
Publikováno v:
Crystals, Vol 13, Iss 5, p 748 (2023)
With the rapid development of microelectronic information technology, microelectronic packaging has higher requirements in terms of integration density, signal transmission speed, and passive component integration. Low temperature co-fired ceramics (
Externí odkaz:
https://doaj.org/article/25560f6b76ce4e68bce246ea322e9eb1
Autor:
Tingnan Yan, Chao Dong, Jianwei Zhao, Amir Khesro, Zheng Liu, Shikuan Sun, Junjie Li, Rong Sun, Dawei Wang
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:15033-15038
Publikováno v:
Ceramics International. 47:34845-34850
The interfacial delamination of electrode/ceramic multilayer structure will seriously damage the reliability of low temperature co-fired ceramic (LTCC) module in practical applications. In this work, three kinds of glasses employed in Au electrode ar
Autor:
Hongtian Li, Shiyu Zhou, Jianwei Zhao, Tingnan Yan, Yuxiao Du, Huanfu Zhou, Yongping Pu, Dawei Wang
Publikováno v:
Journal of Advanced Dielectrics. 13
In this work, novel (1 [Formula: see text])(0.75Na[Formula: see text]Bi[Formula: see text]TiO3)-0.25Sr(Zr[Formula: see text]Sn[Formula: see text]Hf[Formula: see text]Ti[Formula: see text]Nb[Formula: see text])O3-[Formula: see text]NaNbO3 (NBT-SZSHTN-
Autor:
Rong Sun, Zhilun Lu, Hongbo Liu, Dawei Wang, Yuanyuan Wang, Jianwei Zhao, Tingnan Yan, Shifeng Guo
Publikováno v:
Journal of the American Ceramic Society. 105:2020-2028
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publikováno v:
2022 5th International Conference on Signal Processing and Machine Learning.
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:17225-17232
To relieve the camber of Au/ceramic co-fired structure, investigation on the sintering of gold paste with different constituent material properties was performed in this study. The sintering initial temperature of gold paste was correlated with the g