Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Ting-Chiang Tsai"'
Autor:
Ting-Chiang Tsai, 蔡定疆
94
This study use different kinds of instruments to discuss thermal characteristic, surface morphology, crystallization, polarity, optics and rubbing properties of a semi-conducting polymer F8T2. The instrument of Thermo-Gravimetry Analyzer（TG
This study use different kinds of instruments to discuss thermal characteristic, surface morphology, crystallization, polarity, optics and rubbing properties of a semi-conducting polymer F8T2. The instrument of Thermo-Gravimetry Analyzer（TG
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/47622330541030974888
Publikováno v:
Steel and Composite Structures. 15:57-79
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01f9f28df44b7c812264db918c9898ea
https://doi.org/10.12989/scs.2013.15.1.57
https://doi.org/10.12989/scs.2013.15.1.57
Publikováno v:
Sensors and Actuators A: Physical. 160:22-28
In response to the essential role probe cards play in the semiconductor testing industry, a CMOS-MEMS force sensing devices capable of simultaneously monitoring the probe reacting force and electrical test signals is designed for probe cards. The pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c612f88ed18f5a229aead550d1bd24b
https://doi.org/10.1016/j.sna.2010.02.027
https://doi.org/10.1016/j.sna.2010.02.027
Publikováno v:
International Journal of Mechanical Sciences. 51:907-914
In this paper, governing equations of vibration for a beam with distributed internal viscous damping are established by using Timoshenko beam theory and Hamilton's principle. Then, the transfer matrix method is applied to obtain the frequency equatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4aac3a0245220ce6159f5317f34d6ffe
https://doi.org/10.1016/j.ijmecsci.2009.09.039
https://doi.org/10.1016/j.ijmecsci.2009.09.039
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In recent years, as mobile equipment such as cellular phones and PDAs become drastically higher performance and downsized, semiconductor devices are rapidly becoming more integrated and higher speed. As a result of high integration, the pitches of el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f1d0179a06385e1e873e08c23ba5757
https://doi.org/10.1109/impact.2012.6420275
https://doi.org/10.1109/impact.2012.6420275
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Recently, there are many researches on the design of RF probes. Usually the materials of RF probe are tungsten and copper beryllium. They employed fabrication process of soldering and drawing of metal wire, which are not compatible with MEMS or IC fa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7cc84b5812558c16b101d303ae54abd
https://doi.org/10.1109/impact.2012.6420276
https://doi.org/10.1109/impact.2012.6420276
Autor:
Jian-Fu Shih, Yao-Joe Yang, Hao Tian, James K. Breaux, Zhichao Jiao, Cheng-Tang Pan, Taihong Wang, Weihua Si, Minghui Lu, Yi-Kuen Lee, Kang Shi, Vincent Aimez, Wen-Pin Shih, Yong-Sang Kim, Shiyuan Liu, Sandeep Kumar Jha, Zewen Liu, Liming Jiang, Sheng Tu, Olivier Bou-Matar, Leslie Y. Yeo, Lianhuan Han, Yu-Ta Lin, Deyong Chen, Lishuang Feng, Changsheng Yuan, Chung-Yao Yang, Qing Zhou, Junbo Wang, Shuying Cheng, Jeff Wang, Jin-Woo Kim, Dean Ho, Xin Li, Wengang Wu, Zhiwei Li, Ming-Jhe Lin, Rong Zhu, Zhong-Qun Tian, Haixiong Ge, Michael Chen, Chih-Cheng Yang, Jian Qin, Zhihong Li, Zhao-Wu Tian, Haixia Zhang, Ting-Chiang Tsai, Dongping Zhan, Amit Lal, Ray-Hua Horng, He-Tsing Chen, Yi Chiu, Shuai Zhang, Farzam Zoueshtiagh, Gou-Jen Wang, Xin Zhao, Yen-Wen Lu, Wen-Hsin Hsieh, Michael Baudoin, Jianzhang Zhou, Christoph Deneke, Xianghua H. Kong, Wun-Jie Chen, Ping-Hei Chen, Hagen Schmidt, Wei Wang, Huilan Liu, J. Andrew Yeh, Hou-Jun Hsu, Xing Yang, John D. Mai, Guizhang Lu, Baixiang Zheng, Qiangfei Xia, W. H. Hsu, Michel Versluis, Etienne Grondin, Vincent Chabot, Jung-Tang Huang, Oliver G. Schmidt, Paul G. Charette, James Friend, Da-Jeng Yao, Tsung-Han Tsai, Alan Renaudin, Zhaoying Zhou, Yanfeng Chen, Lei Liu, Rong Zhang, Jaw-Ji Tsai, H. Hocheng, Zhiyu Huand Thomas Thundat, Ruya Li, Pak Kin Wong, Philippe Brunet, Wei Tang, Ying-Zong Juang, Michael Junkin, You-Cheol Jang, Cangran Guo, John T.W. Yeow, Wei Wu, Jiaorong Fan, C. Gary Tsai Yeh, Adam Huang, Che-Hsin Lin
Publikováno v:
2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db2739c52eec3933a578c8d130161138
https://doi.org/10.1109/nems.2011.6017595
https://doi.org/10.1109/nems.2011.6017595
Publikováno v:
2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
This paper presents a common platform for packaging micromachined devices, such as motion sensors, microphones, actuator RF switches etc. The method utilizes the semiconductor process, MEMS technique and Electroless technique to build the CMOS-MEMS c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5a259b4891ccbb948c5e71a8aebc611
https://doi.org/10.1109/nems.2011.6017560
https://doi.org/10.1109/nems.2011.6017560
Publikováno v:
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
This paper presents a design of RF MEMS contact switch with high isolation, low insertion loss, small chip area and low power consumption. The switch is fabricated by standard 1P6M 0.18μm CMOS process from TSMC which is compatible with CMOS process.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22b690c27e5cd1b41d1c5c895393a7db
https://doi.org/10.1109/impact.2010.5699553
https://doi.org/10.1109/impact.2010.5699553
Publikováno v:
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
In this study, we use the standard TSMC 0.35 μm 2P4M process to design CMOS-MEMS probe chip. MEMS technology involves the following steps such as lithography process, electroless nickel (EN) plating process, grinding process and dry etching process.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3531763d43d217937c8cfdeb396426c4
https://doi.org/10.1109/impact.2010.5699552
https://doi.org/10.1109/impact.2010.5699552