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Autor:
Terry Ku, Tsung-Shu Lin, Jeng-Shien Hsieh, Chun Shu-Rong, Douglas Yu, Hao-Yi Tsai, Chung-Shi Liu, Tin-Hao Kuo, Chuei-Tang Wang
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
A novel wafer-scale system integration solution, InFO_SoW (System-on-Wafer), has been successfully developed to integrate known-good chips arrays with power and thermal module for high performance computing. InFO_SoW eliminates the use of substrate a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e06ab1b1390cb86fd4f3d2596453df0
https://doi.org/10.1109/ectc32862.2020.00013
https://doi.org/10.1109/ectc32862.2020.00013
