Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Timothy M. Schaefer"'
Autor:
Scott A. Mathews, Douglas B. Chrisey, Chengping Zhang, John Graves, Timothy M. Schaefer, David Liu, Rohit Modi, Barry K. Gilbert, H. D. Wu
Publikováno v:
Microelectronic Engineering. 70:41-49
Seeking better efficiency and faster turn-around in microelectronics manufacturing, a maskless laser direct-write process has been developed and applied to fabricate practical devices. The process uses a short pulse UV laser to transfer material from
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8fc7238b0e59eef07d552b143e389c80
https://doi.org/10.1016/s0167-9317(03)00389-7
https://doi.org/10.1016/s0167-9317(03)00389-7
Autor:
Jonathan Darrel Coker, Barry K. Gilbert, E.S. Daniel, E. Brian Welch, David R. Holmes, Timothy M. Schaefer, Rick A. Philpott
Publikováno v:
Digital Wireless Communications VII and Space Communication Technologies.
While the field of wireless communication has developed dramatically over the past several decades, there are several notable applications of wireless technologies which impose constraints on power-consumption and form-factor that are not compatible
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::51af0f1edc72ff7e1b048b676a3b3c59
https://doi.org/10.1117/12.604255
https://doi.org/10.1117/12.604255
Autor:
Timothy M. Schaefer, B. Gilbert, G.J. Fokken, E. Daniel, Patrick Joseph Zabinski, Michael J. Degerstrom
Publikováno v:
LEOS 2001. 14th Annual Meeting of the IEEE Lasers and Electro-Optics Society (Cat. No.01CH37242).
The minimization of discontinuities in controlled-impedance signal interconnect will be discussed, including novel ideas for extending present packaging fabrication and assembly technology to higher frequency operation.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::adbff6296f69da28f4cecb1b940f770b
https://doi.org/10.1109/leos.2001.969088
https://doi.org/10.1109/leos.2001.969088
Conference
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Conference
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Autor:
Benson, D.C., Yongnan Xuan, Jiamin He, Chang-Ming Lin, Hodges, C.R., Logan, E.A., Schaefer, T.M., Gilbert, B.K.
Publikováno v:
Proceedings of 1997 Wireless Communications Conference; 1997, p175-180, 6p
Autor:
Schwab, Daniel J., Randall, Barbara, Zabinski, Patrick J., Schaefer, Timothy M., Gilbert, Barry K.
Publikováno v:
IEEE Transactions on Advanced Packaging; Feb2002, Vol. 25 Issue 1, p79, 13p, 3 Black and White Photographs, 8 Diagrams, 1 Chart, 4 Graphs
Autor:
Gilbert, B.K., Degerstrom, M.J., Zabinski, P.J., Schafer, T.M., Fokken, G.J., Randall, B.A., Schwab, D.J., Daniel, E.S., Sommerfeldt, S.C.
Publikováno v:
Proceedings of the IEEE; Apr2001, Vol. 89 Issue 4, p426-443, 18p
Autor:
Schaefer, T.M., Kacines, J.J., Randall, B.A., Roszel, L.E., Fokken, G.J., Walter, D., Schwab, D.J., Mowatt, L., Gilbert, B.K.
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology, Part B; 1996, Vol. 19 Issue 2, p403-416, 14p
Autor:
Gilbert, B.K., Schwab, D.J., Randall, B.M., Thompson, R.L., Hakes, R.J., Mielke, L.O., Schaefer, T.M., Zabinski, P.J., Walters, W.L.
Publikováno v:
Workshop on MCM & VLSI Packaging Techniques & Manufacturing Technologies; 1994, p05-06-06, 1p