Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Timothy Dittman"'
Autor:
Ted Habermann, Chad Trabant, Tim Ronan, Manoch Bahavar, Christopher Crosby, Timothy Dittman, Jerry Carter, David Mencin, Yazan Suleiman, Lloyd Carothers, Bruce Beaudoin, Matt Briggs, Garrett Bates
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ecf80491c07f49bbc415e04149e4b92
https://doi.org/10.1002/essoar.10509909.1
https://doi.org/10.1002/essoar.10509909.1
Publikováno v:
International Symposium on Microelectronics. 2017:000619-000623
Reliability in microelectronic packaging has been, and will continue to be, a major concern that must be taken into account early in the design of a package. System-in-package (SiP) assemblies, as well as other high density packaging technologies, ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91fddb08990f7f0ad41a32482bc57e28
https://doi.org/10.4071/isom-2017-tha52_063
https://doi.org/10.4071/isom-2017-tha52_063
Autor:
Timothy Dittman
Publikováno v:
International Symposium on Microelectronics. 2016:000644-000647
Reliability in microelectronic packaging has been, and will continue to be, a major concern that must be taken into account early in the design of a package. Decisions made relative to packaging materials and the methods for achieving environmental p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c848c4b19b434d45733e9cb38377ccef
https://doi.org/10.4071/isom-2016-thp45
https://doi.org/10.4071/isom-2016-thp45