Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Timothy Antesberger"'
Autor:
Frank D. Egitto, Voya R. Markovich, Mark D. Poliks, Rabindra N. Das, Francesco Marconi, Timothy Antesberger
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001949-001976
Material formulation, structuring, and modification are key to increasing the unit volume complexity and density of next generation electronic packaging products. Laser processing is finding an increasing number of applications in the fabrication of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7eaea70d101ce17e8a0879ec47195cb3
https://doi.org/10.4071/2011dpc-wp42
https://doi.org/10.4071/2011dpc-wp42
Autor:
V. Markovich, Steven G. Rosser, William Wilson, Mark Schadt, Rabindra N. Das, Frank Egitto, Timothy Antesberger
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001876-001897
Greater I/O density at the die level, more demanding performance requirements, and the continued desire to package more function into smaller devices is driving the need for improved wiring density and a concomitant reduction in feature sizes for ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5d88f01326a4ea7f7e1b616ef7cdc6f
https://doi.org/10.4071/2011dpc-wp35
https://doi.org/10.4071/2011dpc-wp35