Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Tim S. Koloski"'
Autor:
Mu-San Chen, Tim S. Koloski, J. H. Georger, Charles S. Dulcey, Jeffrey M. Calvert, Walter J. Dressick
Publikováno v:
Advances in Resist Technology and Processing X.
Deep UV photochemical patterning of chemisorbed metal-binding (ligating) organosilane films has been previously used to demonstrate sub-0.5 micrometers patterned additive metallization by electroless deposition. Significant photospeed advantages have
Soft x-ray (14 nm) lithography with ultrathin imaging layers and selective electroless metallization
Autor:
Alastair A. MacDowell, Doowon Suh, Obert R. Wood, Walter J. Dressick, Raissa M. D'Souza, Jeffrey M. Calvert, Franco Cerrina, Charles S. Dulcey, Tim S. Koloski, Martin C. Peckerar, James W. Taylor
Publikováno v:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing III.
Soft x-ray synchrotron radiation, of wavelength 14 nm, has been used to pattern self- assembled monolayer films, which were then selectively metallized using electroless deposition. Organosilane precursors of the general type RSiX3 (R equals organic
Autor:
Tim S. Koloski, Charles S. Dulcey, Obert R. Wood, Raissa M. D'Souza, Walter J. Dressick, Doowon Suh, Alastair A. MacDowell, James W. Taylor, Jeffrey M. Calvert, Martin C. Peckerar, Franco Cerrina
Publikováno v:
Optical Engineering. 32:2437
Soft x-ray synchrotron radiation, of wavelength 14 nm, is used to pattern self-assembled monolayer films, which are then selectively metallized using electroless deposition. Organosilane precursors of the general type RSiX 3 (R=organic functional gro