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pro vyhledávání: '"Tim Nitschke"'
Autor:
Carrie Taylor, Robert Watkins, Wentao Qin, J.P. Gambino, Tim Nitschke, Will Barth, Harold Anderson
Publikováno v:
International Symposium for Testing and Failure Analysis.
Low-K dielectric adhesion problems were observed at M1 and M2 levels during thermal cycling of a flip chip product. Nano-indentation of simple BEOL test structures was used to determine the relative strength of the various interfaces in the BEOL stac