Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Tim Boettcher"'
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-15 (2021)
Abstract The practice of estimating the transfer coefficient ( $$\alpha$$ α ) and the exchange current ( $${i}_{0}$$ i 0 ) by arbitrarily placing a straight line on Tafel plots has led to high variance in these parameters between different research
Externí odkaz:
https://doaj.org/article/f40f1428898d4e38b1ae79858d4aa297
Publikováno v:
Proceedings of the 7th World Congress on Recent Advances in Nanotechnology.
Autor:
Michael Dürrschnabel, Wolfgang Ensinger, Markus Antoni, Ulrike Kunz, Leopoldo Molina-Luna, Tim Boettcher, Tobias Stohr, Sandra Schaefer, Falk Muench
Publikováno v:
Langmuir. 35:4246-4253
Nano-objects are favored structures for applications such as catalysis and sensing. Although they already provide a large surface-to-volume ratio, this ratio can be further increased by shape-selective plating of the nanostructure surfaces. This proc
Autor:
Prashant Khadke, Wolfgang Ensinger, Tim Boettcher, Falk Muench, Ulrike Kunz, Christina Roth, Matthew T. Mayer, Sasho Stojkovikj
Abstract Mass activity and long-term stability are two major issues in current fuel cell catalyst designs. While supported catalysts normally suffer from poor long-term stability but show high mass activity, unsupported catalysts tend to perform bett
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a16155875acd78bd207b2a8c4a79bdd7
Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
As one of challenges, clip design and BOM selection leadframe design for power package is becoming a key to achieve high requirement from customer. However, solder cracks is a key concern for power package during thermal cycling test (TCT) and power
Autor:
Hamrija Ariffin, Tim Boettcher, Izzati Farhana Ab Aziz, Nanthakumar Al Batumalay, Hanizar Hashim
Publikováno v:
36th International Electronics Manufacturing Technology Conference.
In this publication we demonstrate the manufacture of so-called Tandem diodes in a soft-soldered, stacked-die configuration. Compared to the planar product design, where the dies are placed next to each other and wire bonded, the needed board space c
Autor:
Benjamin März, Michael Rother, Tina Li, Kan Lee, Hans-Juergen Funke, Robert Klengel, Mandy Ullrich, Mark Luke Farrugia, Karina Leung, Tim Boettcher, Martin Li, Orla O'Halloran, Andreas Pinkernelle, Matthias Petzold, Michael Kaiser, Stefan Liedtke, Marc Bollmann, Daniel Gruber
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
A detailed description of the Cu-Al wire bond interface is presented, which can possibly explain the often observed corrosion failures in humidity reliability tests. Using micro-structural analysis techniques, it is shown that the unstressed interfac