Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Tilo Welker"'
Publikováno v:
Acta Electrotechnica et Informatica, Vol 17, Iss 2, Pp 11-15 (2017)
The thermal resistance, flow analysis, pressure drop and distribution of coolant inside multilayer LTCC (Low Temperature Co-fired Ceramics) substrate are detailed investigated in this paper. For this reason four various structures of internal channe
Externí odkaz:
https://doaj.org/article/f7546f77abf142379746b688d836d659
Publikováno v:
Vertical-Cavity Surface-Emitting Lasers XXVI.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2a4df7dd41c4f218525c3436e5ed891
https://doi.org/10.1117/12.2610151
https://doi.org/10.1117/12.2610151
Publikováno v:
Journal of Electrical Engineering. 68:132-137
The aim of this paper is detailed investigation of thermal resistance, flow analysis and distribution of coolant as well as thermal distribution inside multilayer LTCC substrates with embedded channels for power electronic devices by simulation softw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc0c9fe2ca1601f096e20c41715d4cfe
https://doi.org/10.1515/jee-2017-0018
https://doi.org/10.1515/jee-2017-0018
Publikováno v:
Scopus-Elsevier
A quasi-monolithic silicon ceramic composite substrate (SiCer), allowing the advantageous combination of silicon MEMS technology with the LTCC technology represents a base substrate for new technology concepts. For the realization of such a substrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e2ec626daaf6433ba9b250d6254d0ed1
https://doi.org/10.4071/2016cicmt-wa22
https://doi.org/10.4071/2016cicmt-wa22
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000103-000106
In this publication the results of laser structuring processes of LTCC substrates, screen printed and laser structured gold thick film lines and the processing procedures are presented. To investigate the compatibility of the laser processes into the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e6213c11ed035fd425a28bcf7bd0d20
https://doi.org/10.4071/2016cicmt-wa21
https://doi.org/10.4071/2016cicmt-wa21
Publikováno v:
2018 48th European Microwave Conference (EuMC).
The ongoing progress and countless possibilities of the low-temperature co-fired ceramics technology in combination with the fiber-optic technology will make future satellite payloads more flexible, lightweight, and economical. Therefore, we have com
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2fe3d490d7a7724ad2ac092d1ff311d
https://doi.org/10.23919/eumc.2018.8541814
https://doi.org/10.23919/eumc.2018.8541814
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000062-000066
The integration density in semiconductor devices is significantly increased in the last years. This trend is already described by Moore's law what forecasts a doubling of the integration density every two years. This evolution makes greater demands o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da19e68f71f593dd81cf4ea6e064572b
https://doi.org/10.4071/cicmt-tp13
https://doi.org/10.4071/cicmt-tp13
Autor:
Tilo Welker, Sumy Mathew, Steffen Spira, Nam Gutzeit, Ralf Stephan, Jens Muller, Matthias Hein
Publikováno v:
2017 47th European Microwave Conference (EuMC).
In the context of the augmented demand for high capacity and uninterrupted communication links, radio-over-fiber technology provides advantage in terms of reduced power dissipation and broad operational frequency bandwidth. In such a link, a vertical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::65f5c7da0e2d85f737d03945321a2c9f
https://doi.org/10.23919/eumc.2017.8230925
https://doi.org/10.23919/eumc.2017.8230925
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
The paper presents a novel manufacturing process which offers a high structure resolution and a high density of electrical contacts on Low Temperature Co-Fried Ceramic (LTCC) for silicon chip assembly. To provide of the small pitch of contacts screen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7005bd72abc90311ae7a071fe38804b2
https://doi.org/10.23919/empc.2017.8346866
https://doi.org/10.23919/empc.2017.8346866
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
The integration density in semiconductor devices has significantly increased in the last years. This trend is already described by Moore's law what forecasts a doubling of the integration density every two years. This evolution makes greater demands
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2271a8c68aff33d1686f8df0fc0290b4
https://doi.org/10.23919/empc.2017.8346859
https://doi.org/10.23919/empc.2017.8346859