Zobrazeno 1 - 10
of 93
pro vyhledávání: '"Tien Yu Tom Lee"'
Autor:
Sun-Il Lee, Yuan Yuan, Il-Koo Kim, Tien-Yu Tom Lee, Min-Su Cheon, Xiaoran Cao, Xiaozhen Zheng, Yun He, Lingzhi Liu, Jeong-Hoon Park
Publikováno v:
IEEE Transactions on Circuits and Systems for Video Technology. 22:1707-1719
A concept of a quadtree based nonsquare block coding structure is presented in this paper for the emerging High Efficiency Video Coding standard, which includes a quadtree based asymmetric motion partitioning scheme and a nonsquare quadtree transform
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79e6364f4f0268a701dcbc58b03d3b29
https://doi.org/10.1109/tcsvt.2012.2223037
https://doi.org/10.1109/tcsvt.2012.2223037
Publikováno v:
Journal of Electronic Packaging. 126:429-434
The increasing trend in power levels and associated densities leads to the need of design thermal optimization, either at the module level or at the system (module-board stack-up) level. The wireless communication industry is facing multiple challeng
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40370047936d15d61e6c5f1574441d3f
https://doi.org/10.1115/1.1827257
https://doi.org/10.1115/1.1827257
Autor:
Tien-Yu Tom Lee, V.A. Chiriac
Publikováno v:
IEEE Transactions on Advanced Packaging. 27:545-557
The thermal performance of front end module (FEM) incorporating low-temperature cofired ceramic (LTCC) substrate is investigated. An infrared microscope system was used to measure device surface temperature with both RF and dc power. Various duty cyc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::907a2908a34e618c49c807503dc0a1b4
https://doi.org/10.1109/tadvp.2004.831868
https://doi.org/10.1109/tadvp.2004.831868
Autor:
Victor Adrian Chiriac, Tien Yu Tom Lee
Publikováno v:
Journal of Electronic Packaging. 125:589-596
The latest commercial applications for microelectronics use GaAs material for RF power amplifier (PA) devices. This leads to the necessity of identifying low cost packaging solutions with high standards for reliability, electrical, and thermal perfor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::43891c1803d13f1c6b710d216b3c5603
https://doi.org/10.1115/1.1604804
https://doi.org/10.1115/1.1604804
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 24:191-198
A previously validated detailed model of a 119-pin Flip-Chip Plastic Ball Grid Array (FC-PBGA) package was created and validated against experimental data for natural convection and forced convection environments. Next, two compact models were derive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::46079c0f18a30254ef376ca17122ef1d
https://doi.org/10.1109/6144.926382
https://doi.org/10.1109/6144.926382
Autor:
Tien Yu Tom Lee, Sarang Shidore
Publikováno v:
Journal of Electronic Packaging. 123:232-237
A detailed model of a die-up 256-pin Plastic Ball Grid Array (PBGA) package was created and validated against experimental data for natural convection and forced convection environments. Next, four compact models were derived; two two-resistor models
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82b62d1be5c3c0eafec63071aa8e0f53
https://doi.org/10.1115/1.1349423
https://doi.org/10.1115/1.1349423
Autor:
Victor A. Chiriac, Tien-Yu Tom Lee
Publikováno v:
Journal of Electronics Manufacturing. :123-129
The Plastic Ball Grid Array (PBGA) package attracts considerable interest, being one of the most promising packaging technologies of the moment. Thermal analysis of a package and a Printed Circuit Board (PCB) stack-up is performed for a better unders
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f8d3be155dd5bd0d1e654e4d8f13dcf
https://doi.org/10.1142/s0960313199000052
https://doi.org/10.1142/s0960313199000052
Autor:
Tien-Yu Tom Lee, Herng-Der Chiou
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C. 21:90-96
This paper describes a unique method to reduce temperature at the end of the Dash thin neck during the process of crystal growth. The thin neck from the conventional Czochralski process is subjected to larger tensile and torsional stresses in growing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6ee0fe3ea4bca60d3f4190c5bc871f57
https://doi.org/10.1109/3476.681384
https://doi.org/10.1109/3476.681384
Publikováno v:
Journal of The Electrochemical Society. 144:2881-2886
Temperature, strength, and stress at the Dash thin neck of large diameter silicon crystals during Czochralski growth are analyzed. The combination stress from the crystal weight, the meniscus weight, and the surface tension are calculated for the ini
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc9b9d3087b645604557d045b629bebc
https://doi.org/10.1149/1.1837911
https://doi.org/10.1149/1.1837911
Publikováno v:
Journal of Electronics Manufacturing. :115-127
The scope of this project is to assess the feasibility of developing thermal models of key component packages for system-level use. Two 32 × 32 mm Ceramic Quad Flat Packages (CQFP): 184 and 240 leads used for high performance microprocessors are eva
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db590fd030d3104366f1adc29e39f769
https://doi.org/10.1142/s0960313197000130
https://doi.org/10.1142/s0960313197000130