Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Tianqing Wu"'
Autor:
Wenxuan Li, Zhikai Zheng, Jiongliang Wang, Tianqing Wu, Juncheng Wang, Yangxun Pan, Jinbin Chen, Dandan Hu, Li Xu, Yaojun Zhang, Minshan Chen, Zhongguo Zhou
Publikováno v:
Journal of Hepatocellular Carcinoma; Mar2024, Vol. 11, p463-475, 13p
Autor:
Jiongliang Wang, Zhikai Zheng, Tianqing Wu, Wenxuan Li, Juncheng Wang, Yangxun Pan, Wei Peng, Dandan Hu, Jiajie Hou, Li Xu, Yaojun Zhang, Minshan Chen, Rongxin Zhang, Zhongguo Zhou
Publikováno v:
Journal of Hepatocellular Carcinoma. 9:999-1010
Jiongliang Wang,1,2,* Zhikai Zheng,1,2,* Tianqing Wu,1,2,* Wenxuan Li,1,2,* Juncheng Wang,1,2 Yangxun Pan,1,2 Wei Peng,1,2 Dandan Hu,1,2 Jiajie Hou,1,2 Li Xu,1,2 Yaojun Zhang,1,2 Minshan Chen,1,2 Rongxin Zhang,2,3 Zhongguo Zhou1,2 1De
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::243036ffe9b96bbe0a4e67933d114f26
https://doi.org/10.2147/jhc.s379326
https://doi.org/10.2147/jhc.s379326
Publikováno v:
International Journal of Heat and Mass Transfer. 135:1167-1191
A stable flow boiling operation is key to enhancing the two-phase cooling performance of microchannel heat sinks. To this end, a novel heat sink is developed which integrates a 300 μm × 600 μm straight microchannel array in the upstream region wit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae32570b6884ab46c1af34036b48314f
https://doi.org/10.1016/j.ijheatmasstransfer.2019.02.033
https://doi.org/10.1016/j.ijheatmasstransfer.2019.02.033
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Advanced cooling solutions are crucial for the further development of modern technologies. Additive manufacturing (AM) helps to remove many of the conventional design constraints and thereby enables the realization of novel heat sink topologies and g
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0999871e636ebca10c9185772363f43
https://doi.org/10.1109/itherm.2019.8757295
https://doi.org/10.1109/itherm.2019.8757295
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
In recent years, there is an increasing need for better cooling solutions to maintain a uniform and low temperature in high power density electronic devices. With much research effort devoted to it, pool boiling has been identified as a promising met
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0789bf78e9c0a85ce23c3ad98168ff0
https://doi.org/10.1109/eptc.2018.8654374
https://doi.org/10.1109/eptc.2018.8654374
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Two-phase cooling using microchannel heat sinks is a promising solution for the thermal management of microelectronic devices. While conventional straight microchannel heat sinks can dissipate large quantities of heat, they suffer from flow instabili
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f80c38c5d8d9d66f83a1053d7cc01dc
https://doi.org/10.1109/eptc.2018.8654344
https://doi.org/10.1109/eptc.2018.8654344
Publikováno v:
International Journal of Heat and Mass Transfer. 156:119812
In this study, the flow boiling performance of the hybrid microchannel-microgap heat sink (Hybrid 1:1), developed for improved boiling stability, is benchmarked against a conventional straight microchannel heat sink (SMC) and microgap heat sink (MG)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6f69c2f1c8ab809af0d1293b0fd3a36
https://doi.org/10.1016/j.ijheatmasstransfer.2020.119812
https://doi.org/10.1016/j.ijheatmasstransfer.2020.119812
Publikováno v:
Asian Journal of Chemistry. 26:8291-8294
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed11a9f5db5cbbee45c1bd3b97d94abd
https://doi.org/10.14233/ajchem.2014.16792
https://doi.org/10.14233/ajchem.2014.16792