Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Tianmin Luan"'
Strengthening mechanism of Al/Sn interfaces: Study from experiments and first-principles calculation
Autor:
Han Yan, Weibing Guo, Tianmin Luan, Xinran Ma, Guojing Xu, Xuesong Leng, Weiwei Zhao, Jiuchun Yan
Publikováno v:
Materials & Design, Vol 212, Iss , Pp 110292- (2021)
The joining of aluminum using a metal of pure Sn as an interlayer or solder was investigated by reactive air soldering and vacuum diffusion bonding. The interfacial structure and mechanical property of the joints were examined. A nanometer-scale inte
Externí odkaz:
https://doaj.org/article/250d67aff37d4333a2bba1f5e75eca94
Publikováno v:
Materials Science and Technology. 38:45-56
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::173ebe5267b754f6a76091181766bd1c
https://doi.org/10.1080/02670836.2021.2023837
https://doi.org/10.1080/02670836.2021.2023837
Publikováno v:
Materials Science and Engineering: A. 836:142687
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::add68d53748cb70b4e2620e01a3c213e
https://doi.org/10.1016/j.msea.2022.142687
https://doi.org/10.1016/j.msea.2022.142687
Publikováno v:
Ultrasonics Sonochemistry. 40:815-821
The fine-grained Al alloys prefer to be soldered at as low as temperature to keep their mechanical properties. Solders of Sn-4Zn, Sn-9Zn, and Sn-20Zn alloys were used to solder fine-grained 7034 Al alloy pieces by ultrasonic-assisted soldering below
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6cbdb0b7c25f26bf39c00af97597cf53
https://doi.org/10.1016/j.ultsonch.2017.08.020
https://doi.org/10.1016/j.ultsonch.2017.08.020
Publikováno v:
Journal of Materials Processing Technology. 248:123-129
The transformation of the intermetallic compounds (IMC) at the interface of Sn-Zn solder and Cu substrate by an ultrasonic-assisted soldering method with the variation of Zn content was investigated. The formation of IMC at the solder/Cu interface is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b79cc677004b1513d2dd7b1e71a194cb
https://doi.org/10.1016/j.jmatprotec.2017.04.019
https://doi.org/10.1016/j.jmatprotec.2017.04.019
Publikováno v:
Materials & Design, Vol 125, Iss, Pp 85-93 (2017)
Fine-grained aluminum alloys are very heat sensitive and overheating can reduce the strength of the material. Filler metals of Zn-5Al and Zn-5Al-3Cu alloys were used to join fine-grained 7034 aluminum alloy pieces by ultrasonic-assisted soldering at
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::24cdd5e56fbfb51c7e2dbdab37197d29
https://doi.org/10.1016/j.matdes.2017.03.073
https://doi.org/10.1016/j.matdes.2017.03.073
Publikováno v:
Ultrasonics Sonochemistry. 36:354-361
High strength aluminum alloys are extremely sensitive to the thermal cycle of welding. An ultrasonic-promoted rapid TLP bonding with an interlayer of pure Zn was developed to join fine-grained 7034 aluminum alloys at the temperature of lower 400°C.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ab85419693b308bbca2e8e0f0b22fc6e
https://doi.org/10.1016/j.ultsonch.2016.12.002
https://doi.org/10.1016/j.ultsonch.2016.12.002
Publikováno v:
Transactions of Nonferrous Metals Society of China. 27:962-970
Soldering aluminum alloys at low temperature have great potential to avoid softening of base metals. Pure Al was soldered with pure tin assisted by ultrasound. The influence of primary α(Al) on the microstructure of Al/Sn interface and its bonding s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5760afcea593e72c9a4502030798fb5
https://doi.org/10.1016/s1003-6326(17)60112-2
https://doi.org/10.1016/s1003-6326(17)60112-2
Publikováno v:
Journal of Materials Processing Technology. 251:93-94
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef32125b840901fe1edef5d6878eb547
https://doi.org/10.1016/j.jmatprotec.2017.07.028
https://doi.org/10.1016/j.jmatprotec.2017.07.028