Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Tianhan Liu"'
Autor:
Yuwaraj Adhikari, Tianhan Liu, Hailong Wang, Zhenqi Hua, Haoyang Liu, Eric Lochner, Pedro Schlottmann, Binghai Yan, Jianhua Zhao, Peng Xiong
Publikováno v:
Nature Communications, Vol 14, Iss 1, Pp 1-9 (2023)
Abstract Chirality has been a property of central importance in physics, chemistry and biology for more than a century. Recently, electrons were found to become spin polarized after transmitting through chiral molecules, crystals, and their hybrids.
Externí odkaz:
https://doaj.org/article/3470f54811e142758d6895d041e52946
Publikováno v:
Crystals, Vol 11, Iss 12, p 1562 (2021)
Full intermetallic compound (IMC) solder joints present fascinating advantages in high-temperature applications. In this study, the mechanical properties and elastic anisotropy of η′-Cu6Sn5 and Cu3Sn intermetallic compounds were investigated using
Externí odkaz:
https://doaj.org/article/fbc574d28cb2487aa5bcf00ef6fcdfd7
Publikováno v:
Nanomaterials, Vol 9, Iss 9, p 1205 (2019)
PbS quantum dots (QDs) are a promising nanostructured material for solar cells. However, limited works have been done to explore the active layer thickness, layer deposition techniques, stability improvement, and cost reduction for PbS QD solar cells
Externí odkaz:
https://doaj.org/article/8d63b5e66e324e159c72d418e8bf325e
Autor:
Zhenqi Hua, Azza Ben-Akacha, Qingquan He, Tianhan Liu, Gillian Boyce, Margaret van Deventer, Xinsong Lin, Hanwei Gao, Biwu Ma, Peng Xiong
Publikováno v:
ACS Energy Letters. 7:3753-3760
Metal halide perovskites possess many physical properties amenable to optoelectronic applications, whereas the realization of these potentials has been hampered by their environmental and electronic instabilities. The morphological and molecular low
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6394be5e0bec823fdd8731ff492e4407
https://doi.org/10.1021/acsenergylett.2c01710
https://doi.org/10.1021/acsenergylett.2c01710
Autor:
Man Li, Huan Wu, Avery, Erin M., Zihao Qin, Goronzy, Dominic P., Huu Duy Nguyen, Tianhan Liu, Weiss, Paul S., Yongjie Hu
Publikováno v:
Science; 11/3/2023, Vol. 382 Issue 6670, p585-589, 5p, 3 Diagrams
The effect of cyclic thermal loading rate on the mechanical behavior of micro-bumps in CoWoS package
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cffeb6b13f9ba90516e21f0ba3b12fb6
https://doi.org/10.1109/eptc56328.2022.10013194
https://doi.org/10.1109/eptc56328.2022.10013194
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c505bff756610b9c869556ae0ca0061c
https://doi.org/10.1109/eptc56328.2022.10013170
https://doi.org/10.1109/eptc56328.2022.10013170
Publikováno v:
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4eeeff93a2ce1a981df2527c580780d
https://doi.org/10.1109/ipfa55383.2022.9915707
https://doi.org/10.1109/ipfa55383.2022.9915707
Autor:
Joon-Il Kim, Tianhan Liu, Konstantinos Kountouriotis, Jun Lu, Xuezhe Yu, Yuwaraj Adhikari, Stephan von Molnár, Jianhua Zhao, Peng Xiong
Publikováno v:
Physical Review Materials. 6
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0161617d3be128798186fed499e80660
https://doi.org/10.1103/physrevmaterials.6.024603
https://doi.org/10.1103/physrevmaterials.6.024603
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
With the development of miniaturization and multifunction of electronic package, the reliability problem of electromigration (EM) and thermomigration (TM) in interconnect solder joints has been prevailing. The purpose in the present study is to probe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::29a510a626631822ef68c77ccb2bfe97
https://doi.org/10.1109/icept52650.2021.9568011
https://doi.org/10.1109/icept52650.2021.9568011