Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Tianan Chen"'
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Conductive adhesives are generally considered to be one of the strongest candidates for replacement of solder in electronics industry. However, some problems related to the performance have so far limited wider applications of conductive adhesives. O
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f05359a2226702d5f3480d679ed616b0
https://doi.org/10.1109/icept.2010.5582437
https://doi.org/10.1109/icept.2010.5582437
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
With the rapid development of technologies on high density assembly and packaging in electronic industry, isotropic conductive adhesive (ICA) has been paid more and more attention as a potential substitute of solder, due to its advantages of low proc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d05dee06aa5561f12d95ba9d698f10d9
https://doi.org/10.1109/icept.2010.5582446
https://doi.org/10.1109/icept.2010.5582446
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Isotropic conductive adhesives (ICAs) are a type of interconnect material used more and more widely in computer, robot, mobile phone, LED and so on. Compared with traditional solders, isotropic conductive adhesives have better working plasticity, cre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::254238e79bb9859795ab11cadb70f823
https://doi.org/10.1109/icept.2010.5582434
https://doi.org/10.1109/icept.2010.5582434
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2010, p225-228, 4p
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2010, p235-239, 5p
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2010, p199-201, 3p