Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Tian-Han Liu"'
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
In this paper, the mechanical properties of Cu 3 Si were researched by the first-principles method. And the method based on density functional theory (DFT). The exchange correlation energy function adopts the generalized gradient approximation (GGA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9995fc7dc9bd98d1121382b7f3259e9
https://doi.org/10.1109/icept52650.2021.9567953
https://doi.org/10.1109/icept52650.2021.9567953
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
In order to investigate the mechanical behavior of microscale solder joints more accurately, the volume effect of mechanical behavior of line-type Cu/Sn/Cu solder joints under tensile load was investigated by finite element analysis (FEA) in this stu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df910ed371cdb59b9a0d9a03a14c83c9
https://doi.org/10.1109/icept50128.2020.9202510
https://doi.org/10.1109/icept50128.2020.9202510
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
In this study, nanoindentation load-displacement curves of an eutectic Sn58Bi alloy were obtained. The measured elastic modulus and hardness were 40.6180 and 0.2886 GPa, respectively. To determine the power-law elastoplastic constitutive relation of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6258c4211a14ae99b9b564a44b1b65f6
https://doi.org/10.1109/icept50128.2020.9202970
https://doi.org/10.1109/icept50128.2020.9202970