Zobrazeno 1 - 10
of 862
pro vyhledávání: '"Tian Xiaoli"'
Publikováno v:
应用气象学报, Vol 35, Iss 4, Pp 467-479 (2024)
Based on the stratified survey data of Pleonomus canaliculatus in the soil of winter wheat and summer maize rotation field in North China Plain, the vertical activity of Pleonomus canaliculatus in the soil of winter wheat and summer maize rotation fi
Externí odkaz:
https://doaj.org/article/365d7dc29b4441568b5c7bb84636cc77
Publikováno v:
应用气象学报, Vol 34, Iss 3, Pp 362-372 (2023)
Sowing date adjustments have been widely used for crop adaptation to climate change, but its impact on crop growth and development is still unclear. Based on field sowing date adjustment experiment of winter wheat Tanmai 98 in the northern part of No
Externí odkaz:
https://doaj.org/article/8524ae7d320545b5887891bec999db88
Publikováno v:
应用气象学报, Vol 31, Iss 5, Pp 620-630 (2020)
In recent years, with the large-scale implementation of conservation tillage measures and crop straw crushing in North China, the winter wheat and summer corn are planted in two crops per year, creating a favorable environment for feeding and habitua
Externí odkaz:
https://doaj.org/article/e19b13b2c5204691a43e41cf7ca7d884
Publikováno v:
Journal of Cotton Research, Vol 3, Iss 1, Pp 1-8 (2020)
Abstract Background Manual topping is a routine agronomic practice for balancing the vegetative and reproductive growth of cotton (Gossypium hirsutum) in China, but its cost-effectiveness has decreased over time. Therefore, there is an urgent need to
Externí odkaz:
https://doaj.org/article/e614c482859a4fde94822330f9df7b8a
Publikováno v:
In Industrial Crops & Products 15 November 2024 220
Autor:
Li, Jun, Li, Yanran, Zhang, Ziyu, Gao, Rongzheng, Zhao, Zihan, Xing, Shichen, Wu, Dongmo, Qi, Heqi, Zhang, Dong, Tian, Xiaoli, Liu, Cheng, Zhu, Lingling, Ma, Chengliang
Publikováno v:
In Applied Surface Science 1 March 2025 684
Publikováno v:
In Information Sciences February 2025 690
Autor:
Xu, Kunhui, Tian, Xiaoli, Wei, Wei, Wang, Xinhua, Bai, Yun, Yang, Chengyue, Tang, Yidan, Li, Chengzhan, Liu, Xinyu, Chen, Hong
Publikováno v:
In Solid State Electronics June 2024 216