Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology.

Autor: Tamil, Jonathan, Siew Hoon Ore, Kian Yeow Gan, Koh, Drake, Ti In, Michael Gantalao, Boon Pek Liew, Teck Wah Park, Ng, Geraldine, Yong Bo Yang, Teh, Daniel, Suthiwongsunthorn, Nathapong, Chungpaiboonpatana, Surasit

Publikováno v: Journal of Microelectronic & Electronic Packaging; 2012 1st Quarter, Vol. 9 Issue 1, p19-30, 12p