Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Thung Beng Joo"'
Publikováno v:
2016 IEEE International Conference on Semiconductor Electronics (ICSE).
Nowadays sustaining semiconductor business needs competitiveness improvement which includes scaling down the technology node from CMOS 0.18µm to 0.13µm using similar equipment platforms. In this paper, the enabling new advances technology is throug
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d72dce29ed6b33656b90c212bc30957a
https://doi.org/10.1109/smelec.2016.7573646
https://doi.org/10.1109/smelec.2016.7573646
Publikováno v:
Proceedings of the International Conference on Industrial Engineering & Operations Management; 2016, p1569-1578, 10p
Publikováno v:
13th International Symposium on the Physical and Failure Analysis of Integrated Circuits.
Detection of killer defects is critical to improving yields in VLSI fabrication. Bright and dark-field inspection tools detect both killer and non-killer defects, and in some cases a high level of nuisance defects may adversely affect the ability to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78087f5f197af1ac6465eba00acd6d13
https://doi.org/10.1109/ipfa.2006.251025
https://doi.org/10.1109/ipfa.2006.251025
Publikováno v:
2006 13th International Symposium on the Physical & Failure Analysis of Integrated Circuits; 2006, p179-182, 4p