Zobrazeno 1 - 10
of 1 626
pro vyhledávání: '"Three-dimensional integrated circuits."'
Autor:
Nakamura, Nathan1,2 (AUTHOR) paul.szypryt@nist.gov, Szypryt, Paul1,2 (AUTHOR) bradley.alpert@nist.gov, Dagel, Amber L.3 (AUTHOR) aldagel@sandia.gov, Alpert, Bradley K.1 (AUTHOR) douglas.bennett@nist.gov, Bennett, Douglas A.1 (AUTHOR) william.doriese@nist.gov, Doriese, William Bertrand1 (AUTHOR) malcolm.durkin@nist.gov, Durkin, Malcolm1,2 (AUTHOR) joe.fowler@nist.gov, Fowler, Joseph W.1,2 (AUTHOR) johnathon.gard@colorado.edu, Fox, Dylan T.3 (AUTHOR) dylfox@sandia.gov, Gard, Johnathon D.1,2 (AUTHOR) kelsey.morgan@nist.gov, Goodner, Ryan N.3 (AUTHOR) rngoodn@sandia.gov, Harris, James Zachariah3 (AUTHOR) esjimen@sandia.gov, Hilton, Gene C.1 (AUTHOR) galen.oneil@nist.gov, Jimenez, Edward S.3 (AUTHOR) blkerne@sandia.gov, Kernen, Burke L.3 (AUTHOR) dmcarth@sandia.gov, Larson, Kurt W.3 (AUTHOR) paschul@sandia.gov, Levine, Zachary H.4 (AUTHOR) zachary.levine@nist.gov, McArthur, Daniel3 (AUTHOR) krthomp@sandia.gov, Morgan, Kelsey M.1,2 (AUTHOR) nathan.ortiz@nist.gov, O'Neil, Galen C.1 (AUTHOR) carl.reintsema@nist.gov
Publikováno v:
Sensors (14248220). May2024, Vol. 24 Issue 9, p2890. 17p.
Autor:
Zhao, Qiutong1,2, Guo, Jingquan1,2, Ye, Shujun1,2 ye.shujun@bit.edu.cn, Zhang, Jingjing1,2, Yu, Lihui1,2
Publikováno v:
ChemistrySelect. 9/4/2024, Vol. 9 Issue 33, p1-8. 8p.
Autor:
Xixin RAO1, Huizhong LIU1, Sai WANG2, Jianhao SONG1, Cheng JIN1, Chengdi XIAO1,3 xcd0719@ncu.edu.cn
Publikováno v:
Thermal Science. 2023, Vol. 27 Issue 5B, p4193-4207. 15p.
Autor:
Feng DAI1, Zhong-Liang PAN1 panzhongliang@m.scnu.edu.cn
Publikováno v:
Thermal Science. 2023, Vol. 27 Issue 5A, p3551-3559. 9p.
Autor:
XU, Zhao-Pei1, WANG, Kang-Jia1 konka05@163.com
Publikováno v:
Thermal Science. 2023, Vol. 27 Issue 3B, p2391-2398. 8p.
Thermal Modeling and Analysis of 3D ICS with Heat Dissipation Effect of Power Distribution Networks.
Autor:
Feng, Yinghao1 (AUTHOR), Dong, Gang1 (AUTHOR) gdong@xidian.edu.cn, Liu, Daihang1 (AUTHOR), Zhi, Changle1 (AUTHOR), Yang, Deguang1 (AUTHOR), Wang, Yang1 (AUTHOR), Zhu, Zhangming1 (AUTHOR), Yang, Yintang1 (AUTHOR)
Publikováno v:
Journal of Circuits, Systems & Computers. Jul2024, p1. 24p.
Autor:
Kung, Po-Yu1 (AUTHOR), Huang, Wei-Lun1 (AUTHOR), Kao, Chin-Li2 (AUTHOR), Lin, Yung-Sheng2 (AUTHOR), Hung, Yun-Ching2 (AUTHOR), Kao, C. R.1 (AUTHOR) crkao@ntu.edu.tw
Publikováno v:
Materials (1996-1944). Nov2022, Vol. 15 Issue 21, p7783. 12p.
Autor:
Lu, Tsan-Feng1 (AUTHOR) s0881513.c@nycu.edu.tw, Yen, Yu-Ting1 (AUTHOR), Wang, Pei-Wen1 (AUTHOR), Cheng, Yuan-Fu1 (AUTHOR), Chen, Cheng-Hsiang1 (AUTHOR), Wu, YewChung Sermon1 (AUTHOR) sermonwu@stanfordalumni.org
Publikováno v:
Nanomaterials (2079-4991). May2024, Vol. 14 Issue 10, p861. 8p.
Autor:
Lu, Tsan-Feng1 (AUTHOR) s0881513.c@nycu.edu.tw, Wang, Pei-Wen1 (AUTHOR), Cheng, Yuan-Fu1 (AUTHOR), Yen, Yu-Ting1 (AUTHOR), Wu, YewChung Sermon1 (AUTHOR) sermonwu@stanfordalumni.org
Publikováno v:
Nanomaterials (2079-4991). May2024, Vol. 14 Issue 9, p771. 13p.
Autor:
Shen, Yu-An1 (AUTHOR) yashen@fcu.edu.tw, Wu, John A.2 (AUTHOR) wu1696@purdue.edu
Publikováno v:
Materials (1996-1944). Jul2022, Vol. 15 Issue 14, pN.PAG-N.PAG. 20p.