Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Thompson IAP"'
Autor:
Kong D; Department of Radiology, Stanford University, Stanford, California 94305, United States., Thompson IAP; Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States., Maganzini N; Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States., Eisenstein M; Department of Radiology, Stanford University, Stanford, California 94305, United States.; Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States., Soh HT; Department of Radiology, Stanford University, Stanford, California 94305, United States.; Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States.
Publikováno v:
ACS sensors [ACS Sens] 2024 Mar 22; Vol. 9 (3), pp. 1168-1177. Date of Electronic Publication: 2024 Feb 26.
Autor:
Hariri AA; Department of Radiology, Stanford University, Stanford, CA, 94305, USA., Cartwright AP; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Dory C; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Gidi Y; Department of Radiology, Stanford University, Stanford, CA, 94305, USA., Yee S; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Thompson IAP; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Fu KX; Department of Radiology, Stanford University, Stanford, CA, 94305, USA.; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Yang K; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Wu D; Department of Bioengineering, Stanford University, Stanford, CA, 94305, USA., Maganzini N; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Feagin T; Department of Radiology, Stanford University, Stanford, CA, 94305, USA., Young BE; Department of Radiology, Stanford University, Stanford, CA, 94305, USA., Afshar BH; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Eisenstein M; Department of Radiology, Stanford University, Stanford, CA, 94305, USA., Digonnet MJF; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Vuckovic J; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Soh HT; Department of Radiology, Stanford University, Stanford, CA, 94305, USA.; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA.; Department of Bioengineering, Stanford University, Stanford, CA, 94305, USA.; Department of Chemical Engineering, Stanford University, Stanford, CA, 94305, USA.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Jan; Vol. 36 (1), pp. e2304410. Date of Electronic Publication: 2023 Nov 27.
Autor:
Park CH; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA.; Department of Radiology, Stanford University, Stanford, CA, 94305, USA.; Department of Chemical and Biological Engineering, Gachon University, Seongnam, 13120, Republic of Korea., Thompson IAP; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA.; Department of Radiology, Stanford University, Stanford, CA, 94305, USA., Newman SS; Department of Bioengineering, Stanford University, Stanford, CA, 94305, USA., Hein LA; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Lian X; Department of Radiology, Stanford University, Stanford, CA, 94305, USA., Fu KX; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA.; Department of Radiology, Stanford University, Stanford, CA, 94305, USA.; Department of Chemistry and Biochemistry, University of Notre Dame, Notre Dame, IN, 46556, USA., Pan J; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA.; Department of Radiology, Stanford University, Stanford, CA, 94305, USA.; Department of Mechanical and Aerospace Engineering, Herbert Wertheim College of Engineering, University of Florida, Gainesville, FL, 32611, USA., Eisenstein M; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Soh HT; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA.; Department of Radiology, Stanford University, Stanford, CA, 94305, USA.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Jan; Vol. 36 (4), pp. e2306704. Date of Electronic Publication: 2023 Nov 29.
Autor:
Friedel M; Novel Device Laboratory, Department of Biomedical Engineering, University of Cincinnati, Cincinnati, OH, USA., Thompson IAP; Department of Electrical Engineering, Stanford University, Stanford, CA, USA., Kasting G; The James L. Winkle College of Pharmacy, University of Cincinnati Academic Health Center, Cincinnati, OH, USA., Polsky R; Nano and Micro Sensors, Sandia National Laboratories, Albuquerque, NM, USA., Cunningham D; Department of Chemistry and Physics, Southeast Missouri State University, Cape Girardeau, MO, USA., Soh HT; Department of Electrical Engineering, Stanford University, Stanford, CA, USA. tsoh@stanford.edu.; Department of Radiology, Stanford University, Stanford, CA, USA. tsoh@stanford.edu., Heikenfeld J; Novel Device Laboratory, Department of Biomedical Engineering, University of Cincinnati, Cincinnati, OH, USA. heikenjc@ucmail.uc.edu.
Publikováno v:
Nature biomedical engineering [Nat Biomed Eng] 2023 Dec; Vol. 7 (12), pp. 1541-1555. Date of Electronic Publication: 2023 Jan 19.
Autor:
Thompson IAP; Department of Electrical Engineering, Stanford University, Stanford, CA 94305, USA., Saunders J; Department of Electrical Engineering, Stanford University, Stanford, CA 94305, USA., Zheng L; Department of Radiology, Stanford University, Stanford, CA 94305, USA., Hariri AA; Department of Radiology, Stanford University, Stanford, CA 94305, USA., Maganzini N; Department of Electrical Engineering, Stanford University, Stanford, CA 94305, USA., Cartwright AP; Department of Electrical Engineering, Stanford University, Stanford, CA 94305, USA., Pan J; Department of Mechanical and Aerospace Engineering, Herbert Wertheim College of Engineering, University of Florida, Gainesville, FL 32611, USA., Yee S; Department of Electrical Engineering, Stanford University, Stanford, CA 94305, USA., Dory C; Department of Electrical Engineering, Stanford University, Stanford, CA 94305, USA., Eisenstein M; Department of Electrical Engineering, Stanford University, Stanford, CA 94305, USA.; Department of Radiology, Stanford University, Stanford, CA 94305, USA., Vuckovic J; Department of Electrical Engineering, Stanford University, Stanford, CA 94305, USA., Soh HT; Department of Electrical Engineering, Stanford University, Stanford, CA 94305, USA.; Department of Radiology, Stanford University, Stanford, CA 94305, USA.
Publikováno v:
Science advances [Sci Adv] 2023 Sep 22; Vol. 9 (38), pp. eadh4978. Date of Electronic Publication: 2023 Sep 22.
Autor:
Trinh T; Department of Radiology, Stanford University, Stanford, California 94305, United States., Thompson IAP; Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States., Clark F; Department of Chemistry, The University of Vermont, Burlington, Vermont 05405, United States., Remington JM; Department of Chemistry, The University of Vermont, Burlington, Vermont 05405, United States., Eisenstein M; Department of Radiology, Stanford University, Stanford, California 94305, United States., Li J; Department of Chemistry, The University of Vermont, Burlington, Vermont 05405, United States.; Department of Medicinal Chemistry and Molecular Pharmacology, Purdue University, West Lafayette, Indiana 47907, United States., Soh HT; Department of Radiology, Stanford University, Stanford, California 94305, United States.; Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States.
Publikováno v:
ACS nano [ACS Nano] 2022 Sep 27; Vol. 16 (9), pp. 14549-14557. Date of Electronic Publication: 2022 Sep 12.
Autor:
Thompson IAP; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Zheng L; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Eisenstein M; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA.; Department of Radiology, Stanford University, Stanford, CA, 94305, USA.; Chan Zuckerberg Biohub, San Francisco, CA, 94158, USA., Soh HT; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA. tsoh@stanford.edu.; Department of Radiology, Stanford University, Stanford, CA, 94305, USA. tsoh@stanford.edu.; Chan Zuckerberg Biohub, San Francisco, CA, 94158, USA. tsoh@stanford.edu.
Publikováno v:
Nature communications [Nat Commun] 2020 Jun 10; Vol. 11 (1), pp. 2946. Date of Electronic Publication: 2020 Jun 10.
Autor:
Wilson BD; Department of Chemical Engineering, Stanford University, Stanford, CA, 94305, USA., Hariri AA; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Thompson IAP; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA., Eisenstein M; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA.; Department of Radiology, Stanford University, Stanford, CA, 94305, USA., Soh HT; Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA. tsoh@stanford.edu.; Department of Radiology, Stanford University, Stanford, CA, 94305, USA. tsoh@stanford.edu.; Chan Zuckerberg Biohub, San Francisco, CA, 94158, USA. tsoh@stanford.edu.
Publikováno v:
Nature communications [Nat Commun] 2019 Nov 07; Vol. 10 (1), pp. 5079. Date of Electronic Publication: 2019 Nov 07.