Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Thomas-Michael Winkel"'
Autor:
Evan Fledell, Elmar Griese, Mohamed Sahouli, Jonatan Aronsson, Jose A. Hejase, Wui-Weng Wong, Feng Ling, Ali E. Yilmaz, Fei Guo, Kemal Aygun, Thomas-Michael Winkel, Rohit Sharma, W. Dale Becker, Michael J. Hill, Kaisheng Hu, Stefano Grivet Talocia, Yi-Ru Jeong, Zhen Peng, Heidi Barnes, Pavel Roy Paladhi, Alexander Pelger, Tingdong Zhou, Jose E. Schutt-Aine, Benjamin Silva, Nam H. Pham, Chang Liu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4d763c4358516114c10adcfe1e0fd0a1
http://hdl.handle.net/11583/2947707
http://hdl.handle.net/11583/2947707
Autor:
Thomas-Michael Winkel
Publikováno v:
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Chip package to chip package differential signal line measurements were performed to investigate increased via coupling effects. In via fields, the high frequency signal return was spread over different combinations of power and GND vias. Results are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf3a30582eb3e1417fd5fbfeaaef5b84
https://doi.org/10.1109/epeps.2017.8329737
https://doi.org/10.1109/epeps.2017.8329737
Autor:
Hubert Harrer, Jochen Supper, Thomas-Michael Winkel, Renato Rimolo-Donadio, Christian Schuster
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 54:495-498
In this letter, the parasitic mode conversion that occurs at microstrip to stripline transitions is analyzed through electromagnetic simulations and an equivalent circuit including the parallel-plate impedance. It is shown that the excitation of plat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1f0c65d913c35858d0e6917bb02fcd4
https://doi.org/10.1109/temc.2011.2182054
https://doi.org/10.1109/temc.2011.2182054
Autor:
C.W. Surovic, Alina Deutsch, Young H. Kwark, George A. Katopis, Zhen Zhou, Zhaoqing Chen, Xiaoxiong Gu, Roger S. Krabbenhoft, Kathleen L. Melde, Thomas-Michael Winkel, Theodorus E. Standaert, Gerard V. Kopcsay
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 52:266-287
A comprehensive overview is given of the strengths, limitations, and applicability of the short-pulse propagation technique (SPP). SPP is shown to be able to extract the broadband characteristics of a wide range of interconnect technologies found in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e392db2e68a0a6b2259f849197b96d13
https://doi.org/10.1109/temc.2009.2037971
https://doi.org/10.1109/temc.2009.2037971
Autor:
Renato Rimolo-Donadio, Hubert Harrer, Christian Schuster, Xiaomin Duan, Thomas-Michael Winkel, Young H. Kwark, Thomas Strach
Publikováno v:
2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.
Considerations for comprehensive simulation and analysis of high-speed links in complex server systems are discussed in this work. A framework that considers the interactions between multiple signals and the power distribution network is described. I
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0bc9857d6a2d408f133005272d3e6037
https://doi.org/10.1109/epeps.2012.6457834
https://doi.org/10.1109/epeps.2012.6457834
Autor:
Hubert Harrer, Dion Timmermann, Christian Schuster, Thomas-Michael Winkel, C. Siviero, Renato Rimolo-Donadio, Young H. Kwark
Eye diagrams are often used for the evaluation of the signal quality of high-speed links in digital systems. This article deals with the question of how to efficiently simulate eye diagrams of links that suffer from multiple aggressors. Specifically,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::76714ff90f89e7f2c13eb215dec3a236
http://hdl.handle.net/11583/2660756
http://hdl.handle.net/11583/2660756
Autor:
Christian Schuster, Heinz-Dietrich Bruns, Hubert Harrer, Thomas-Michael Winkel, C. Siviero, Renato Rimolo-Donadio, Dierk Kaller
The effective design of passive interconnect links in a pre-layout phase may be a challenging task that involve multidimensional trade-off analyses to find an optimum between system performance and cost. Highly efficient interconnect models can be us
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1a296045d9ab22fd7ef8697c6f004b43
http://hdl.handle.net/11583/2660751
http://hdl.handle.net/11583/2660751
Autor:
Heinz-Dietrich Bruns, Miroslav Kotzev, Thomas-Michael Winkel, Christian Schuster, Roland Frech, Hubert Harrer, Andreas Huber, Dierk Kaller
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
In this paper the authors present results from the crosstalk analysis of a high density single ended connector and its associated card via array obtained with 12-port vector network analyzer (VNA) measurements in the bandwidth from 10 MHz up to 20 GH
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b98d070ea5cbdee10359728acdc7a70
https://doi.org/10.1109/estc.2010.5642944
https://doi.org/10.1109/estc.2010.5642944
Publikováno v:
2006 IEEE Workship on Signal Propagation on Interconnects.
Special test vehicles with and without broken high frequency signal return paths were built in order to measure their impact on signal integrity. Design guidelines for the transition between different packaging levels are derived and discussed.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e1755c52b96a511f73fa466b6190b49d
https://doi.org/10.1109/spi.2006.289246
https://doi.org/10.1109/spi.2006.289246
Publikováno v:
56th ARFTG Conference Digest.
The electrical scattering field at steps on interconnects can be taken into account by a virtual additional line length of the wider line [1]. This effect must be taken into account when characterizing on and off-chip interconnects with discontinuiti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a60d4600f98e64b4e4ac2330cffb485
https://doi.org/10.1109/arftg.2000.327445
https://doi.org/10.1109/arftg.2000.327445