Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Thomas W. Goodman"'
Publikováno v:
IEEE Transactions on Advanced Packaging. 23:220-226
There has been a significant amount of work over the past five years on chip scale packaging. The majority of this work has been an extension of conventional integrated circuit (IC) packaging technology utilizing either wire bonders or tape automated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06630e1df637a76990e4f2fd7579e2aa
https://doi.org/10.1109/6040.846638
https://doi.org/10.1109/6040.846638
Publikováno v:
Proceedings of Japan International Electronic Manufacturing Technology Symposium.
A 181 pin Pin Grid Array (PGA) was characterized using time and frequency domain techniques to identify major sources of signal degradation. The pins, as well as a layer of plating lines that was included for electroplating the exterior metal surface
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5e374980267cbbd1edef6b83fe1907c0
https://doi.org/10.1109/iemt.1993.639776
https://doi.org/10.1109/iemt.1993.639776
Publikováno v:
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
A Land Grid Array (LGA) package was designed and fabricated to utilize specific materials and design concepts for high speed operation. The performance of this LGA was compared with that of a functionally and dimensionally equivalent Pin Grid Array (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::35f290c1ff977f22e3e1f0f0db635c60
https://doi.org/10.1109/ectc.1993.346812
https://doi.org/10.1109/ectc.1993.346812
Publikováno v:
2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225).
The main drivers for packaging in highly functional, miniaturized portable products are small form factor and cost. Established technologies such as quad flat packs (QFP) and small outline packages (SOP) have been available to designers for years. Re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::107e0e992f39fa331027e29ea9dbd2dd
https://doi.org/10.1109/iemtim.1998.704623
https://doi.org/10.1109/iemtim.1998.704623
Publikováno v:
Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.
The Ball Grid Array (BGA) package has been developed to provide a high density, leadless surface mount alternative to existing packages. The development of BGA packages represents a departure from the established road map for packaging. BGAs are unde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9807efeeecdf4d01de0942d67a261330
https://doi.org/10.1109/iemt.1995.541028
https://doi.org/10.1109/iemt.1995.541028
Autor:
R. Moody, C. Schneider, D. Patterson, J. Leal, Scott Barrett, Thomas W. Goodman, Deok Hoon Kim, Hannah Yang, Peter Elenius, Young-Do Kweon, R. Moraca
Publikováno v:
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
Ultra CSP/sup TM/ is a wafer-level chip scale package developed by Flip Chip Technologies. This package provides a low cost packaging solution for various applications such as integrated passive, flash memory, DRAM, and Direct RDRAM/sup TM/ devices.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c45a37f4e1d66f3f0458eb66b779883
https://doi.org/10.1109/ectc.2000.853389
https://doi.org/10.1109/ectc.2000.853389
Conference
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Conference
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Conference
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Conference
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.