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pro vyhledávání: '"Thomas Thamm"'
Autor:
Thomas Thamm, Yael Sufrin, Avi Cohen, Ofir Sharoni, Aravind Narayana Samy, Rolf Seltmann, Thomas Scheruebl
Publikováno v:
2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Advanced process control in lithography and overall patterning is of tremendous importance for advanced semiconductor Fabs to ensure enhanced chip performance and yield. The final patterning result and subsequent yield are dependent upon many process
Publikováno v:
2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).
Advanced process control in lithography and overall patterning is of tremendous importance for advanced semiconductor Fabs to ensure chip performance and yield. The final patterning result and thus yield depend on many process parameters such as lith
Publikováno v:
VLSI-DAT
Advanced process control in lithography and overall patterning is of tremendous importance for advanced semiconductor Fabs to ensure chip performance and yield. The final patterning result and thus yield depend on many process parameters such as lith
Autor:
Avi Cohen, Yael Sufrin, Thomas Thamm, Aravind Narayana Samy, Ofir Sharoni, Rolf Seltmann, Thomas Scheruebl
Publikováno v:
Photomask Technology 2019.
Excursion prevention is one of the key points in the mission of leading edge foundries. In this paper, we concentrate on patterning excursions and how to prevent them. This strategy concentrates pro-actively on the task to minimize the distributions
Autor:
Aravind Narayana Samy, Bernd Geh, Alla Bitensky, Marija Djordjevic Kaufmann, Thomas Thamm, Martin Sczyrba, Rolf Seltmann
Publikováno v:
Optical Microlithography XXXI.
Within the current paper, we will concentrate on the well-known CDC technique from Carl Zeiss to improve the CD distribution of the wafer by improving the reticle CDU and its impact on hotspots and Litho process window. The CDC technique uses an ultr
Autor:
Werner A. Goedel, Erik Strub, Günter Marx, Jörg Röhrich, Daniel Wett, Wolfgang Bohne, Thomas Thamm, Rüdiger Szargan
Publikováno v:
Microchimica Acta. 156:53-56
The deposition of boron carbonitride layers on silicon substrates by a microwave plasma enhanced chemical vapour deposition (MW-PECVD) process using N-trimethylborazine (TMB) and benzene as precursors is presented. As plasma gases argon and nitrogen
Autor:
Iris Abt, Wolf Haertel, Julia Meinhold, Berthold Baumann, Gerald Stilp, Dirk Herms, Thomas Thamm
Alaska und das Yukon Territory verkörpern Einsamkeit, Abenteuerlust, eine fast unberührte Natur und den Mythos des Goldes.Es gibt viele Möglichkeiten, die Region zu entdecken und so waren unsere Autoren ohne Grenzen mit dem Kanu unterwegs, mit Fah
Autor:
Selvi Gopalakrishnan, Remi Riviere, Stephanie Maelzer, Thomas Thamm, Yee Mei Foong, Guoxiang Ning, Nikolay Oleynik, Paul Ackmann
Publikováno v:
SPIE Proceedings.
One of the objectives of a robust optical proximity correction (OPC) model is to simulate the process variation including 3D mask effects or mask models for different mask blanks. Assuming that the data of different reticle blanks is the same, the wa
Autor:
Guoxiang Ning, Frank Richter, Fang Hong Gn, Karin Kurth, Thomas Thamm, Andre Leschok, Paul Ackmann, Marc Staples, Joerg Schenker, Francois Weisbuch
Publikováno v:
SPIE Proceedings.
Reticle critical dimension uniformity (CDU) is an important criterion for the qualification of mask layer processes. Normally, the smaller the three sigma value of reticle CDU is, the better is the reticle CDU performance. For qualification of mask p
Autor:
Frank Richter, Fang Hong Gn, Stefan Roling, Christian Buergel, Marc Staples, Anthony Zhou, Thomas Thamm, Guoxiang Ning, Andre Leschok, Paul Ackmann, Chin Teong Lim
Publikováno v:
SPIE Proceedings.
Dummy pattern fill is added to a layout of a reticle for the purpose of raising the pattern-density of specific regions. The pattern-density has also an influence on different process-steps which were performed when manufacturing a reticle (e.g. prox