Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Thomas Loher"'
Publikováno v:
2022 IEEE CPMT Symposium Japan (ICSJ).
Autor:
Stefan Kosmider, Thomas Loher, Andreas Ostmann, Kavin Murugesan, Uwe Maab, Martin Schneider-Ramelow, Le Thi Huyen, Michael Kaiser
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Autor:
David Schutze, Marcus Voitel, Stefan Gottwald, Malte Spanier, Karl-Friedrich Becker, Andreas Ostmann, Thomas Loher, Andreas Hofmeister, Martin Schneider-Ramelow
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Publikováno v:
Flexible, Wearable, and Stretchable Electronics
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3dab5e08b90df81dcc1f3eec7a58dde0
https://doi.org/10.1201/9780429263941-11
https://doi.org/10.1201/9780429263941-11
Autor:
Andreas Ostmann, Christine Kallmayer, Manuel Seckel, Thomas Loher, Joao Marques, Julian Haberland, Malte von Krshiwoblozki
Publikováno v:
2019 IEEE CPMT Symposium Japan (ICSJ).
The ongoing miniaturization at different levels seems to be an constant in electronics development. It allows not only to increase in functionality in novel product generations, but also the spreading of electronics into new environments. In recent y
Autor:
Charles Joubert, Christian Martin, Oriol Avino-Salvado, Pierre Demumieux, Fabien Sixdenier, Cyril Buttay, Jean Sylvio Ngoua Teu Magambo, Thomas Loher
Publikováno v:
Proceedings of the 2019 IEEE Applied Power Electronics Conference
APEC
APEC, Mar 2019, Anaheim, Californie, United States. pp.18720757, ⟨10.1109/APEC.2019.8722279⟩
APEC
APEC, Mar 2019, Anaheim, Californie, United States. pp.18720757, ⟨10.1109/APEC.2019.8722279⟩
International audience; Increasing electrification in transport sectors, from automotive to aerospace, highlights the need for low size and high power density components. The recent advent of planar technology theoretically allows to reduce considera
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ee48e49e0bc4439924212cf0478e1f78
https://hal.science/hal-02076183/document
https://hal.science/hal-02076183/document
Autor:
Julian Haberland, Andre Schult, Christine Kallmayer, Fabian Kayatz, Florian Schaller, Thomas Loher
Publikováno v:
2018 13th International Congress Molded Interconnect Devices (MID).
3D conformable electronic systems have attracted considerable attention lately. New technologies to realize such 3D electronics not only save weight and volume in known applications - e.g. car interior. They also allow completely new functionalities
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In stretchable electronics, meander designs are often used for the conducting traces. This geometry of the copper traces, that are much stiffer than the polymer substrates, allows for better stretchability. In order to be able to assess the meander r